Transparent Array Base Plate for Back Detection of Cold Joints
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Solution Overview
Problem
The manufacturing of Mini LED and Micro LED display products faces challenges due to cold joints during the soldering process, leading to imperfect conduction between LED chips and substrates, which deteriorates the quality of the display products.
Innovation Solution
An array base plate is designed with a substrate featuring multiple light transmitting areas and a conductive layer with conductive-pad groups. The light transmitting areas have a transmittance of at least 50% and overlap with the conductive pads, allowing for back detection of connection imperfections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is made opaque to ensure structural integrity and electrical conductivity, then the reliability of conduction is improved, but the ability to detect connection imperfections through visual inspection deteriorates
Solution Approach 1:
The substrate is segmented into light transmitting areas and non-light transmitting areas. The light transmitting areas allow visual detection of connection imperfections, while the non-light transmitting areas provide structural support and electrical conductivity. This segmentation resolves the contradiction by spatially separating the functions of detection and conduction.
Solution Approach 2:
Different regions of the substrate are assigned different optical properties. Specifically, certain areas are made transparent or translucent to enable visual inspection of the soldering connections, while other areas maintain opacity for structural integrity. This local differentiation of quality allows simultaneous achievement of detectability and reliability.
2Difficulty of detecting and measuring
If light transmitting areas are added to enable detection, then the detection capability is improved, but the device structure becomes more complex
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides structural support, electrical conductivity, and optical transparency for detection. By making the substrate itself multi-functional rather than adding separate detection components, the invention improves detection capability while minimizing increases in device complexity.
Solution Approach 2:
The substrate structure itself enables the detection function through its light transmitting areas. The substrate serves its own inspection needs by incorporating transparent regions that allow direct visual observation of connection quality, eliminating the need for separate complex detection systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables accurate detection of connection imperfections between element devices and conductive pads, improving the reliability of the soldering process and enhancing the quality of Mini/Micro LED display products.
Implementation Method 1
a transmittance of parts of the substrate that are located at the first light transmitting areas is greater than or equal to a first preset value
Data Source
AI summary
The present application provides an array base plate and a detecting method thereof, and a light emitting apparatus, which relates to the technical field of displaying. The array base plate includes: a substrate, wherein the substrate includes a plurality of first light transmitting areas; and a first conductive layer located on the substrate; the first conductive layer includes a plurality of conductive-pad groups, and each of the conductive-pad groups includes at least one conductive pad; an overlapping area exists between an orthographic-projection area of the conductive pad on the substrate and one of the first light transmitting areas; and a transmittance of parts of the substrate that are located at the first light transmitting areas is greater than or equal to a first preset value.


