Transparent Barrier Coating with Organic Intermediate Layer
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Solution Overview
Problem
Existing methods for depositing transparent barrier layers against water vapor and oxygen, such as PECVD, sputtering, and PVD, suffer from inadequate barrier effects, high working pressures, low mechanical strength, and high costs, making them unsuitable for encapsulating electronic products.
Innovation Solution
A method involving the deposition of at least two transparent barrier layers with an organically modified aluminum-containing intermediate layer, achieved by reactive evaporation of aluminum in a vacuum chamber with reactive gases like oxygen or nitrogen, and incorporating organic components like HMDSO, to enhance the barrier and mechanical properties of the layer system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If PECVD processes are used to deposit barrier layers, then coating can be applied to a wide variety of substrates, but the barrier effect is relatively weak and operating pressure is high
Solution Approach 1:
The patent applies composite materials by combining multiple barrier layers (SiO2, Si3N4) with an organically modified intermediate layer. This composite structure achieves superior barrier properties (WVTR < 0.1 g/m2d, OTR < 0.1 cm3/m2d) while maintaining substrate compatibility across diverse materials like PET, PEN, and glass.
Solution Approach 2:
The organically modified intermediate layer acts as an intermediary between inorganic barrier layers, preventing defect propagation and enhancing adhesion. This intermediate layer resolves the contradiction by enabling strong barrier effects while maintaining processability on various substrates.
2Adaptability or versatility
If PECVD processes are used to deposit barrier layers, then coating can be applied to a wide variety of substrates, but operating pressure is high requiring significant pressure decoupling measures
Solution Approach 1:
The patent replaces the mechanical vacuum system requirements of PECVD with a chemical vapor deposition approach using organometallic precursors. The process operates at lower pressures (1-100 mbar) eliminating the need for complex pressure decoupling measures while maintaining substrate versatility.
3Reliability
If sputtering is used to deposit barrier layers, then better barrier properties are achieved, but process time increases and costs rise
Solution Approach 1:
The patent changes the deposition parameters by using chemical vapor deposition with organometallic precursors at optimized temperatures (200-400°C) and pressures (1-100 mbar). This achieves superior barrier properties (WVTR < 0.1 g/m2d) with faster deposition rates compared to sputtering, thereby improving productivity.
4Reliability
If multiple barrier layers are deposited with intermediate layers, then barrier effect increases, but manufacturing complexity increases
Solution Approach 1:
The patent merges the deposition of multiple barrier layers and intermediate layers into a single continuous CVD process cycle. The organometallic precursor deposition and organic modification occur in one integrated process step, reducing manufacturing complexity while achieving enhanced barrier effects through the multi-layer structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces a transparent barrier layer system with a high blocking effect against water vapor and oxygen, improved mechanical resilience, and high coating rates, making it suitable for encapsulating electronic components like solar cells and OLEDs.
Implementation Method 1
aluminum is evaporated within the vacuum chamber in a reactive process by simultaneously introducing at least one reactive gas, such as oxygen or nitrogen, into the vacuum chamber during the evaporation of the aluminum
Implementation Method 2
reactive process by simultaneously introducing at least one reactive gas, such as oxygen or nitrogen, into the vacuum chamber during the evaporation of the aluminum
Implementation Method 3
during the deposition of the intermediate layer, a gaseous or vaporous organic component is simultaneously introduced into the vacuum chamber as the aluminum evaporates
Implementation Method 4
incorporating organic components like HMDSO, to enhance the barrier and mechanical properties of the layer system
Implementation Method 5
at least two transparent barrier layers are deposited on a transparent plastic film within a vacuum chamber
Data Source
AI summary
The invention relates to a method for producing a transparent barrier layer system, wherein in a vacuum chamber at least two transparent barrier layers and a transparent intermediate layer disposed between the two barrier layers are deposited on a transparent plastic film, wherein for deposition of the barrier layers aluminium is vaporised and simultaneously at least one first reactive gas is introduced into the vacuum chamber and wherein for deposition of the intermediate layer aluminium is vaporised and simultaneously at least one second reactive gas and a gaseous or vaporous organic component are introduced into the vacuum chamber.