Transparent Carrier LED Device Heat Dissipation
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Solution Overview
Problem
Existing LED light-emitting devices have low luminous efficiency due to light being blocked by metal supports and excessive heat generation, leading to reduced reliability and shorter service life.
Innovation Solution
A transparent carrier with conductors for eutectic bonding of LED chips, a transparent encapsulation structural member, and heat-dissipating layers to allow multi-dimensional light emission and efficient heat management, reducing heat accumulation and improving electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal support or metal substrate is used to encapsulate LED chips, then structural strength is improved, but light transmission is blocked and heat dissipation is reduced
Solution Approach 1:
The patent extracts the light-blocking metal support from the encapsulation structure and replaces it with a transparent carrier. This removes the harmful light absorption property while maintaining the necessary structural support function through the transparent carrier and encapsulation resin combination.
Solution Approach 2:
The patent changes the optical parameter of the carrier material from opaque (metal) to transparent (resin or glass), fundamentally altering how light interacts with the support structure. This enables light transmission while maintaining structural integrity through material property transformation.
2Stability of the object's composition
If a metal support or metal substrate is used to encapsulate LED chips, then structural stability is improved, but heat accumulation increases
Solution Approach 1:
The patent removes the metal support that causes heat accumulation and replaces it with a transparent carrier having lower thermal mass and better thermal management characteristics, thereby reducing heat trapping while preserving structural stability.
Solution Approach 2:
The patent employs a composite structure combining transparent carrier material with encapsulation resin, creating a hybrid system that provides both structural stability and improved thermal management compared to solid metal supports.
3Adaptability or versatility
If wire connections are used to connect LED chips, then electrical connection flexibility is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the electrical connection function with the structural carrier by integrating conductor traces directly into the carrier substrate. This eliminates separate wire connections and reduces manufacturing steps while maintaining electrical connectivity.
Solution Approach 2:
The patent replaces the mechanical wire connection system with an integrated conductor trace system embedded in the carrier, substituting a complex mechanical assembly process with a simpler integrated manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances luminous efficiency by 30-50% and extends service life while simplifying manufacturing by eliminating complex wire connections and improving heat dissipation.
Implementation Method 1
LED (Light Emitting Diode) has been applied to many fields due to its advantages of energy conservation, environmental protection, light weight, long service life, small volume, stable performance
Implementation Method 2
a carrier, which is a transparent body... an encapsulation structural member, which is a transparent body and encapsulates on the periphery of the carrier and the plurality of LED chips
Implementation Method 3
a plurality of LED chips, which are electrically connected to the conductors by way of eutectic bonding, so as to realize electrical connection among the plurality of LED chips
Data Source
AI summary
Provided is a LED light-emitting device including: a carrier, which is a transparent body, and on a carrying surface of which conductors are provided; a plurality of LED chips, which are electrically connected to the conductors by way of eutectic bonding, so as to realize electrical connection among the plurality of LED chips; an encapsulation structural member, which is a transparent body and encapsulates on the periphery of the carrier and the LED chips; and a pair of electrodes, wherein positive electrode/negative electrodes in the pair of electrodes are electrically connected to the LED chips located at the most upstream/most downstream of a current transmission in the plurality of LED chips by means of the conductors, and extend to the outside of the encapsulation structural member.