Transparent Carrier Scribe Line Opaque Marker for Optical Singulation
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Solution Overview
Problem
The challenge in manufacturing semiconductor package devices with transparent materials is accurately aligning scribe lines during optical singulation techniques, as transparent materials fail to detect or recognize these lines, leading to misalignment issues.
Innovation Solution
Incorporating an opaque or non-transparent material on scribe lines of a transparent carrier, which remains adjacent to the semiconductor package device post-singulation, improves alignment during optical singulation by serving as a detectable marker.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical singulation techniques are used on transparent carrier, then singulation operation can be performed, but alignment accuracy deteriorates because transparent materials fail to detect scribe lines
Solution Approach 1:
The patent applies an opaque or non-transparent material on the scribe lines of the transparent carrier, creating a visible contrast that enables optical detection systems to accurately detect and align with the scribe lines during singulation operations, thereby resolving the alignment accuracy issue while maintaining productivity
Solution Approach 2:
The opaque material serves as an intermediary layer between the transparent carrier and the optical detection system. This intermediary provides the necessary optical contrast for the detection system to function properly on transparent substrates, enabling accurate alignment without compromising the transparency of the final product
2Manufacturing precision
If opaque material is added on scribe lines to improve alignment, then alignment accuracy improves, but device complexity increases due to additional material layers
Solution Approach 1:
The opaque material is applied to the scribe lines before the singulation operation, preparing the carrier in advance for accurate optical detection. This preliminary action ensures alignment accuracy is achieved without requiring complex real-time adjustments or additional processing steps during manufacturing
Solution Approach 2:
The opaque material is applied selectively only on the scribe lines rather than uniformly across the entire carrier. This localized application provides the necessary alignment functionality while minimizing the impact on overall device complexity and maintaining the transparency of the functional areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures accurate alignment and successful singulation of semiconductor package devices, reducing damage and improving the manufacturing process efficiency by utilizing the opaque material as a visible marker for optical techniques.
Implementation Method 1
improves alignment during optical singulation by serving as a detectable marker
Data Source
AI summary
A semiconductor package device includes a transparent carrier, a first patterned conductive layer, a second patterned conductive layer, and a first insulation layer. The transparent carrier has a first surface, a second surface opposite to the first surface and a third surface extended between the first surface and the second surface. The first patterned conductive layer is disposed on the first surface of the transparent carrier. The first patterned conductive layer has a first surface coplanar with the third surface of the transparent carrier. The second patterned conductive layer is disposed on the first surface of the transparent carrier and electrically isolated from the first patterned conductive layer. The first insulation layer is disposed on the transparent carrier and covers the first patterned conductive layer.