Transparent Chip Encapsulation Structure for Precise Optical Assembly

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Solution Overview

Problem

Conventional electronic devices with integrated optical elements face challenges due to shape uncertainties and defects in the transparent resin blocks, which affect precise assembly and optical performance.

Innovation Solution

The electronic device features a transparent encapsulation structure with controlled shape and optical properties, bonded onto a base substrate, and an opaque cover with local openings to manage light entry and exit, eliminating the need for precise saw alignment and reducing shape defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional saw cutting is used to separate resin blocks, then production efficiency is maintained, but shape precision and alignment accuracy deteriorate due to saw wear and alignment uncertainties

Engineering Contradiction:

Improveshape precision of resin blocksVSAvoidproduction efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The transparent encapsulation structure is designed and formed with precise shapes and integrated chip mounting areas before the chips are mounted. This preliminary formation of precise structures eliminates the need for subsequent saw cutting operations, thereby maintaining both high production efficiency and excellent shape precision without saw wear or alignment issues

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention extracts and eliminates the problematic saw cutting process from the production flow. Instead of forming chips on a substrate and then cutting them apart, the solution takes out the separation step entirely by forming individual encapsulation structures that are ready for chip mounting without requiring precision saw operations

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If transparent resin blocks are used to encapsulate chips, then optical transparency is achieved, but shape control and assembly precision deteriorate due to production uncertainties

Engineering Contradiction:

Improveassembly precisionVSAvoidshape control of encapsulation structure

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The transparent encapsulation structure is formed as an integrated composite structure combining the encapsulation body and chip mounting areas in a single molded piece. This integration ensures consistent material properties and precise geometric control throughout the structure, eliminating shape variations that would occur with separate resin blocks

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The invention changes the manufacturing parameters from conventional resin casting and saw cutting to precision molding processes that directly form the encapsulation structure with controlled shapes and dimensions. This parameter change enables tight tolerances and consistent geometry essential for precise assembly

Inventive Principle:

Principle #35Parameter changes

3Device complexity

If chips are mounted on substrate and then separated by cutting, then production flow is simplified, but optical performance deteriorates due to gaps and shape defects

Engineering Contradiction:

Improveproduction process complexityVSAvoidoptical performance

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The encapsulation structure is preliminarily formed with precise optical surfaces and chip mounting areas before chip attachment. This preliminary precision formation eliminates subsequent alignment and gap issues that would compromise optical performance, while the integrated design keeps the production process straightforward

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the precision and reliability of electronic device assembly by controlling the shape and optical properties of the encapsulation structure, reducing production uncertainties, and ensuring optimal optical performance.

Implementation Method 1

a transparent encapsulation structure bonded onto the base substrate

Methodology Applied

Scientific EffectBonding: Adhesive

Implementation Method 2

supporting a light-filtering optical wafer located facing each optical element

Methodology Applied

Scientific EffectOptical filtering: Filter (optical)

Implementation Method 3

an opaque cover covering the transparent encapsulation structure, and including a local opening located facing each optical wafer

Methodology Applied

Scientific EffectLight blocking: Absorption (EM radiation)

Data Source

PatentUS12288961B2Electronic device comprising a transparent encapsulation structure housing an electronic chip and corresponding production method

Publication Date: 2025.04.29 STMICROELECTRONICS (GRENOBLE 2) SAS

AI summary

An electronic device includes a base substrate having a mounting face. An electronic chip is fastened onto the mounting face of the base substrate. A transparent encapsulation structure is bonded onto the base substrate. The transparent encapsulation structure includes a housing with an internal cavity defining a chamber housing the electronic chip. The encapsulation structure has an external face that supports a light-filtering optical wafer located facing an optical element of the electronic chip. An opaque cover covers the transparent encapsulation structure and includes a local opening facing the light-filtering optical wafer.