Transparent Conductive Blocks for Display Panel Electrical Connection

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Solution Overview

Problem

The manufacturing processes for liquid crystal display panels are complex and costly due to the need for multiple steps to form ITO layers and connect them with Au balls, which increases production costs and decreases efficiency.

Innovation Solution

A display panel design featuring transparent conductive blocks made from the same material as the ITO layers, which are integrally formed with the conductive layers, allowing for electrical connection without the need for Au balls, thereby simplifying the manufacturing process and reducing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If Au balls are used to connect ITO layers between substrates, then electrical connection is achieved, but manufacturing complexity and production cost increase

Engineering Contradiction:
Improveelectrical connectionVSAvoidmanufacturing process
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the function of the Au ball connector with the ITO conductive layer by making the ITO layer extend directly from the substrate onto the protrusion structure. This eliminates the need for separate Au ball components and their associated positioning and bonding processes, thereby reducing manufacturing complexity while maintaining electrical connection functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts and eliminates the Au ball component from the assembly by replacing it with an extended ITO layer forming a protrusion. This removal of the intermediate connector simplifies the overall structure and reduces the number of manufacturing steps required to achieve electrical connection between substrates.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If multiple manufacturing processes are used to connect ITO layers with Au balls, then electrical connection is achieved, but production efficiency decreases

Engineering Contradiction:
Improveelectrical connectionVSAvoidproduction efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent combines the electrical connection function into a single integrated ITO protrusion structure that is formed during the existing ITO layer deposition process. This merging eliminates multiple sequential operations (ITO layer formation, Au ball placement, bonding), thereby significantly improving production efficiency while ensuring reliable electrical connection.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If Au balls are used for electrical connection, then conduction is achieved, but material cost increases

Engineering Contradiction:
Improveelectrical conductionVSAvoidmaterial cost
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

The patent makes the ITO layer serve multiple functions: it provides both the conductive pathway on the substrate and the extended protrusion structure for electrical connection. This multi-functionality eliminates the need for separate Au ball materials, reducing material costs while maintaining effective electrical conduction between substrates.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces the number of manufacturing processes required, increases production efficiency, and lowers material costs by using transparent conductive photoresist to form conductive blocks that facilitate electrical connections between substrates, while maintaining good conduction and light transmission properties.

Implementation Method 1

The transparent conductive photoresist has not only good conduction, but also has good light transmission. The transparent conductive photoresist in the present application may be formed by adding metal particles into a transparent photoresist to realize the conduction through the metal particles.

Methodology Applied
Scientific EffectElectrical conduction through metal particles: Conduction (electrical)

Implementation Method 2

The transparent conductive photoresist has not only good conduction, but also has good light transmission.

Methodology Applied
Scientific EffectLight transmission through transparent photoresist: Absorption (EM radiation)

Data Source

PatentUS10732450B2Display panel and manufacturing process thereof
Publication Date: 2020.08.04 HKC CORP LTD
  • US10732450B2 patent drawing
  • US10732450B2 patent drawing
  • US10732450B2 patent drawing

AI summary

The present application discloses a display panel and a manufacturing process thereof. The display panel includes a first substrate and a second substrate. The first substrate is provided with a first transparent conductive layer. The second substrate is disposed opposite to the first substrate, and the second substrate is provided with a second transparent conductive layer. A plurality of transparent conductive blocks are spacedly positioned between the first transparent conductive layer and the second transparent conductive layer, and the transparent conductive blocks are electrically connected to the first transparent conductive layer and the second transparent conductive layer. The transparent conductive blocks are made from a same material as the first transparent conductive layer; or the transparent conductive blocks are made from a same material as the second transparent conductive layer; or the transparent conductive blocks are made from a same material as the first transparent conductive layer and the second transparent conductive layer. And the transparent conductive blocks are integrally formed with the first transparent conductive layer; or the transparent conductive blocks are integrally formed with the second transparent conductive layer; or the transparent conductive blocks are integrally formed with the first transparent conductive layer and the second transparent conductive layer.