Transparent Conductive Electrode Fabrication Using Sacrificial Layer
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Solution Overview
Problem
The existing methods for fabricating transparent conductive electrodes, such as those using Indium Tin Oxides (ITO), often result in etching residues that can cause leakage current and short circuits due to the ITO grain, affecting the quality of the product.
Innovation Solution
A fabrication method involving a sacrificial layer pattern with an upper sharp corner profile is used, where the transparent conductive thin-film is formed with a thickness ratio less than or equal to 1:1.5 to the sacrificial layer, and the sacrificial layer is removed through wet etching, ensuring no residue is left and maintaining the integrity of the transparent conductive electrode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional patterning process with photoresist and mask plate is used to fabricate transparent conductive electrode, then the electrode can be formed with specific pattern, but etching residue appears which causes leakage current and short circuit
Solution Approach 1:
The patent applies preliminary action by forming a sacrificial layer pattern before depositing the transparent conductive thin-film. This sacrificial layer is designed with specific geometry (upper sharp corner profile) that pre-determines the final electrode pattern. The thin-film is deposited conformally on this sacrificial structure, and subsequent removal of the sacrificial layer automatically creates the desired electrode pattern without requiring photoresist coating, masking, and etching processes, thereby eliminating etching residues that cause reliability issues
Solution Approach 2:
The patent uses a sacrificial layer as an intermediary element to achieve the final electrode pattern. This temporary structure serves as a mold or template during the thin-film deposition process. The sacrificial layer is removed after the thin-film is formed, leaving behind the desired electrode pattern. This intermediary approach avoids direct etching of the conductive material, preventing the formation of harmful etching residues while maintaining manufacturing precision
2Reliability
If the transparent conductive thin-film thickness is reduced to prevent residue, then the risk of leakage current decreases, but the electrode may become discontinuous
Solution Approach 1:
The patent applies local quality by creating a thickness gradient in the transparent conductive thin-film through conformal deposition on the sacrificial layer structure. The film maintains uniform thickness relative to the sacrificial layer at each location, but the overall thickness distribution is optimized based on the local geometry of the sacrificial layer. This allows the film to be thin enough to prevent residue formation in critical areas while maintaining sufficient thickness and continuity in areas where the sacrificial layer provides adequate support, thus resolving the contradiction between reliability and strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents etching residues, ensuring high-quality transparent conductive electrodes with reduced risk of leakage current and short circuits, thereby enhancing the reliability of the product.
Implementation Method 1
forming a transparent conductive thin-film in the first and second regions of the substrate with the sacrificial layer pattern formed thereon
Implementation Method 2
removing the sacrificial layer pattern so as to reserve the transparent conductive thin-film in the first region as the transparent conductive electrode
Data Source
AI summary
Fabrication methods of a transparent conductive electrode (301) and an array substrate are provided. The fabrication method of the transparent conductive electrode (301) comprises: forming a sacrificial layer pattern (201) on a substrate (10) having a first region (A1) and a second region (A2) adjacent to each other, wherein the sacrificial layer pattern (201) is located in the second region (A2), and has an upper sharp corner profile formed on a side adjacent to the first region (A1); forming a transparent conductive thin-film (30) in the first region (A1) and the second region (A2) of the substrate (10) with the sacrificial layer pattern (201) formed thereon, wherein a thickness ratio of the transparent conductive thin-film (30) to the sacrificial layer pattern (201) is less than or equal to 1:1.5, and the transparent conductive thin-film (30) is disconnected at the upper sharp corner profile of the sacrificial layer pattern (201), such that at least a part of a side surface of the sacrificial layer pattern (201) facing the first region (A1) is exposed; and removing the sacrificial layer pattern (201) so as to reserve the transparent conductive thin-film (30) in the first region as the transparent conductive electrode (301).