Transparent Conductive Structure Thermal Pattern Formation
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Solution Overview
Problem
Existing methods for manufacturing transparent conductive patterns on display and touch substrates require etching, which can lead to uneven visual quality and increased material costs due to the need for etching liquids.
Innovation Solution
A method involving the formation of a heat insulation layer on a transparent conductive layer, with window regions exposing the layer, followed by heating to create insulating regions without etching, allowing the transparent conductive layer to maintain conductivity while the exposed areas become insulating, thus eliminating the need for etching and improving uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If etching is used to remove parts of the transparent conductive film, then the transparent conductive pattern can be formed, but the visual quality becomes uneven and material costs increase
Solution Approach 1:
The patent replaces the chemical etching process with a thermal processing approach. By forming a heat insulation layer with window regions and heating the transparent conductive film through these windows, the film is selectively removed in desired patterns without using etching chemicals. This substitution eliminates the visual non-uniformity caused by etching while maintaining pattern formation capability
Solution Approach 2:
The patent introduces a heat insulation layer as an intermediary element between the heating source and the transparent conductive film. This layer with window regions controls the heating distribution, allowing selective thermal removal of the film only in exposed areas while protecting other regions. The intermediary enables precise spatial control of the thermal process
2Ease of manufacture
If etching is used to form transparent conductive patterns, then the patterns can be created, but etching liquids are required which increase material costs
Solution Approach 1:
The patent substitutes chemical etching with thermal processing. Instead of using etching liquids to remove material, the invention uses controlled heating through window regions to thermally remove or modify the transparent conductive film. This eliminates the need for expensive etching chemicals while achieving the same pattern formation result
Solution Approach 2:
The patent changes the processing parameter from chemical (etching liquid concentration, exposure time) to thermal (heating temperature, heating duration). By controlling thermal parameters and the window region geometry, the same pattern formation function is achieved without consuming etching materials, thereby reducing material costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the visual uniformity and reduces material costs by eliminating the need for etching, while maintaining the conductivity of the transparent conductive regions and transforming exposed areas into insulating regions through controlled heating.
Implementation Method 1
forming a heat insulation layer on a surface of the transparent conductive layer away from the substrate, the heat insulation layer having at least one window region exposing the transparent conductive layer; heating the transparent conductive layer for a preset time period, to form at least one insulating region on the transparent conductive layer
Data Source
AI summary
The present disclosure provides a transparent conductive structure and a preparation method thereof, a display substrate, and a touch substrate, which belongs to the technical field of display panels. The transparent conductive structure is provided on a substrate. The method for manufacturing a transparent conductive structure includes: providing the substrate; forming a transparent conductive layer on the substrate; forming a heat insulation layer on a surface of the transparent conductive layer away from the substrate, the heat insulation layer having at least one window region exposing the transparent conductive layer; heating the transparent conductive layer for a preset time period, to form at least one insulating region on the transparent conductive layer; and removing the heat insulation layer.