Transparent Die Semiconductor Package for Optical Coupling and Low Warpage
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Solution Overview
Problem
The semiconductor industry faces challenges in packaging System-on-Integrated-Circuit (SoIC) components due to the need for smaller, more creative packaging techniques that support miniaturization, higher speed, greater bandwidth, lower power consumption, and reduced latency, while addressing issues related to thermal expansion coefficients and packaging process complexities.
Innovation Solution
A semiconductor package design featuring a photonic integrated circuit die, an electric die connected through hybrid bonding, and a transparent die without circuit components that allows optical signals to pass through, surrounded by a transparent encapsulating material to facilitate optical communication and reduce thermal warpage, with the transparent material and encapsulating layer occupying less than 35% of the die area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If traditional packaging techniques are used for SoIC components, then manufacturing process is simpler, but integration density and miniaturization are limited
Solution Approach 1:
The packaging structure is divided into distinct functional layers: a substrate, an optical waveguide layer, an electrical interconnect layer, and an encapsulant. This segmentation allows each layer to be optimized independently for its specific function while maintaining overall integration density
Solution Approach 2:
The patent transitions from planar 2D packaging to 3D vertical stacking, with the optical waveguide layer positioned between the substrate and electrical interconnect layer. This dimensional change enables higher integration density by utilizing vertical space rather than only horizontal expansion
2Area of moving object
If feature size is reduced to increase integration density, then more components can be integrated, but manufacturing precision requirements increase
Solution Approach 1:
The patent changes the material parameters of the optical waveguide layer, using materials with specific refractive indices and thermal expansion coefficients that are matched to the substrate. This parameter matching allows for relaxed manufacturing tolerances while maintaining high integration density
3Reliability
If different materials are used for optical and electrical components, then functional performance is improved, but thermal expansion mismatch causes warpage
Solution Approach 1:
The optical waveguide layer serves as an intermediary layer between the substrate and electrical interconnect layer. This intermediate layer is specifically designed with thermal expansion properties that bridge the mismatch between the substrate and the electrical components, preventing warpage while maintaining optical and electrical functionality
Solution Approach 2:
The patent employs material homogeneity in the optical waveguide layer by using materials with matched thermal expansion coefficients throughout the layer. This homogeneous composition ensures uniform thermal behavior and prevents differential expansion that would cause warpage
4Speed
If bonding density is increased for higher speed and bandwidth, then transmission performance improves, but manufacturing complexity increases
Solution Approach 1:
The patent merges the optical waveguide function and electrical interconnect function into a single integrated layered structure. The optical waveguide layer and electrical interconnect layer are formed simultaneously or in sequence using the same manufacturing processes, combining multiple functions without proportionally increasing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances bonding density, transmission speed, and bandwidth density while reducing energy consumption and minimizing thermal warpage issues, ensuring the quality and performance of the semiconductor package.
Implementation Method 1
a transparent portion (2202) formed in the second die (420) and overlapping the optical coupler (1102), wherein the transparent portion (2202) allows an optical signal received by the optical coupler (1102) to pass through the second die (420)
Implementation Method 2
a transparent encapsulating material (140) disposed on the first die (110) and laterally encapsulating the second die (420) and the third die (130)... wherein a top surface of the transparent portion (2202) is coplanar with a top surface of the transparent encapsulating material (140)
Implementation Method 3
The third die (130) is bonded to the first die (110) through a hybrid bonding technique such that the metallization structure (1303) of the third die (130) is in contact with the metallization structure (1105) of the first die (110) without a gap therebetween
Data Source
AI summary
A semiconductor package including a first die, a second die and a transparent encapsulation material is provided. The first die includes a first substrate and an optical coupler formed on the first substrate. The second die is disposed on the first die and includes a transparent portion overlapping the optical coupler. The transparent encapsulation material is disposed on the first die and laterally encapsulates the second die.