Transparent Display Pad Layout for Higher Aperture Ratio
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Solution Overview
Problem
Existing transparent display panels face challenges in increasing the aperture ratio and transparency due to the large area of mini-ICs used to drive light-emitting diodes, which obstructs the light transmission and reduces the display's clarity.
Innovation Solution
The design incorporates a light-transmitting substrate with a pad group and a mini-IC bonded to the pad group, where the first wire includes a winding segment that bypasses the second pad, allowing for a more efficient electrical connection and reducing the resistance-capacitance loading, thereby increasing the aperture ratio and transparency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If mini-ICs are used to replace part of the circuit structure functions, then the layout area of the circuit structure is reduced, but the mini-IC area is significantly larger and obstructs light transmission
Solution Approach 1:
The pad group is divided into multiple structurally separated pads (first pad, second pad, third pad) arranged in a specific pattern. This segmentation allows the wiring to be optimized locally, reducing the need for extensive metal layer overlapping while maintaining electrical connections to the mini-IC.
Solution Approach 2:
The wire is designed with a winding segment that extends in a non-linear path between pads, utilizing the available space more efficiently. This dimensional approach to wire routing reduces the need for direct overlapping of metal layers, thereby reducing the effective area occupied by the circuit structure.
2Illumination intensity
If the aperture ratio is increased to improve transparency, then more light can transmit, but the wiring structure becomes more complex and requires more overlapping metal layers
Solution Approach 1:
The wire structure is optimized locally by introducing a winding segment between specific pads (second pad and third pad). This local modification allows the wire to bypass obstacles and reduce overlapping with other metal layers only where necessary, rather than redesigning the entire wiring structure.
Solution Approach 2:
The wire includes a winding segment that follows a curved or non-linear path between pads, rather than a straight line. This curvature allows the wire to navigate around obstacles and reduce the need for multiple overlapping metal layers, simplifying the overall wiring structure while maintaining connectivity.
3Reliability
If metal layers are overlapped to achieve electrical connections, then connectivity is ensured, but the resistance-capacitance loading increases and transparency decreases
Solution Approach 1:
The winding segment design extracts the wire path from a direct overlapping configuration and redirects it through available space. This reduces the length and complexity of overlapping metal layers, thereby reducing the resistance-capacitance loading while maintaining electrical connectivity between pads.
Data Source
AI summary
A display apparatus includes a light-transmitting substrate, a pad group, a mini-IC, a first wire, and a first light-emitting element. The pad group includes a first pad, a second pad, and a third pad. The mini-IC is bonded to the pad group. The first wire is electrically connected to the first pad. The first pad and the second pad have first sides and second sides opposite to each other. The third pad is located on the first sides of the first pad and the second pad. The first wire is structurally separated from the second pad and the third pad. A winding segment of the first wire is disposed between the second pad and the third pad and bypasses the second pad from the first sides of the first pad and the second pad so as to extend toward the second sides of the first pad and the second pad.