Transparent Electrode Cooling in Laser Substrate Processing

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Solution Overview

Problem

During semiconductor processing, the use of heat sources to heat substrates unintentionally damages peripheral components due to excessive heating, which affects the reliability and efficiency of the processing apparatus.

Innovation Solution

A substrate processing apparatus is designed with a cooling device that includes a gas injection block and suction block to form a controlled airflow along the transparent electrode, cooling it while it is exposed to a laser beam, thereby preventing thermal damage and maintaining the electrode's temperature within a safe range.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a heat source is used to heat the substrate to a predetermined temperature, then the substrate processing efficiency is improved, but the peripheral components are unintentionally heated and deteriorate

Engineering Contradiction:
Improvesubstrate processing efficiencyVSAvoidperipheral component durability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

A transparent electrode is introduced as an intermediary component between the laser beam and the substrate. The electrode transmits the laser beam while allowing separate control of heating and cooling functions, enabling the substrate to be heated without directly exposing peripheral components to intense laser energy

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the physical state and properties of the transparent electrode by controlling its temperature through cooling gas flow. By adjusting the temperature parameter of the electrode, the system can process substrates at high temperatures while maintaining the electrode itself within safe operational limits

Inventive Principle:
Principle #35Parameter changes

2Temperature

If the substrate is heated using a heat source, then the desired processing temperature is achieved, but other peripheral components are unintentionally heated and may deteriorate

Engineering Contradiction:
Improvesubstrate temperatureVSAvoidthermal damage to peripheral components
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The cooling device is positioned to apply cooling gas locally to the transparent electrode in the region where laser energy is concentrated. This localized cooling creates a temperature gradient that protects the electrode and surrounding peripheral components from thermal damage while allowing the substrate to reach the required processing temperature

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The transparent electrode serves as a mediator that can be selectively cooled independent of the substrate heating process. This allows precise control of thermal conditions - the substrate receives full laser heating while the electrode is protected by localized cooling

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The cooling device effectively prevents thermal damage to the transparent electrode, enhancing the reliability and longevity of the substrate processing apparatus by maintaining the electrode's temperature within a predetermined range during substrate heating processes.

Implementation Method 1

a cooling device configured to cool the transparent electrode by injecting a cooling gas toward the transparent electrode

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

a first gas injection block including at least one first injector configured to inject the cooling gas; and a first suction block including at least one first suction port configured to suck the cooling gas

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Implementation Method 3

a laser supply head configured to supply a laser beam toward the substrate supported on the support table via the transparent electrode and the dielectric plate

Methodology Applied
Scientific EffectLaser heating: Laser

Data Source

PatentUS20240006160A1Substrate processing apparatus
Publication Date: 2024.01.04 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US20240006160A1 patent drawing
  • US20240006160A1 patent drawing
  • US20240006160A1 patent drawing

AI summary

Provided is a substrate processing apparatus including a chamber including a processing space; a support table provided within the processing space of the chamber and configured to support a substrate; a dielectric plate covering an opening in an upper wall of the chamber; a transparent electrode provided on the dielectric plate; a laser supply head configured to supply a laser beam toward the substrate supported on the support table via the transparent electrode and the dielectric plate; and a cooling device configured to cool the transparent electrode by injecting a cooling gas toward the transparent electrode.