Transparent Electrode Layout for LED Wire Alignment Tolerance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The alignment of connecting wires with the small electrodes of LEDs in lighting and display devices is difficult, leading to misalignment and incomplete current loops, which prevents normal light emission.
Innovation Solution
The use of transparent electrodes with larger surface areas than the connection pads or second electrodes, facilitating easier alignment and ensuring reliable electrical connections by covering the smaller pads or electrodes, thereby forming complete current loops.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connecting wires are used to electrically connect the upper electrode and lower electrode of each LED, then electrical connection is achieved, but alignment difficulty increases due to the small size of LEDs
Solution Approach 1:
The patent merges the connection pad structure with the electrode structure by making the connection pad extend beyond the electrode boundaries. This integration allows the connecting wire to connect to the extended connection pad rather than requiring precise alignment with the small electrode, thus maintaining electrical connection reliability while significantly reducing alignment precision requirements
Solution Approach 2:
The extended connection pad acts as an intermediary element between the electrode and the connecting wire. By extending the connection pad beyond the electrode, it provides a larger target area that mediates the connection process, making it easier to align the connecting wire while ensuring reliable electrical connection to the underlying electrode
2Productivity
If the size of LED is reduced to micron scale for high-density arrangement, then device integration increases, but alignment difficulty of connecting wires increases
Solution Approach 1:
The connection pad is merged with the electrode structure and intentionally extended beyond the electrode boundaries. This design allows micron-scale LEDs to be densely arranged while the extended connection pads provide larger alignment targets, thus maintaining high device integration density without proportionally increasing alignment difficulty
Solution Approach 2:
The electrical connection structure is segmented into distinct functional zones: the small electrode area for light emission, the extended connection pad area for wire connection, and the insulating layer for electrical isolation. This segmentation allows each component to be optimized independently - small electrodes for high density and extended connection pads for ease of alignment
3Reliability
If connecting wires are aligned with small LED electrodes, then current loop formation is achieved, but misalignment occurs leading to incomplete current loops
Solution Approach 1:
The connection pad is merged with the electrode structure and extended beyond its boundaries, creating a larger target area that is easier to align with connecting wires. This ensures that even with manufacturing tolerances, the connecting wire can reliably connect to the extended connection pad, completing the current loop without requiring difficult precision alignment
Solution Approach 2:
The extended connection pad provides a buffer zone or cushion against alignment errors. By extending the connection pad beyond the electrode, it anticipates and compensates for potential misalignment during manufacturing, ensuring that the connecting wire can still make reliable contact and complete the current loop despite variations in alignment precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances manufacturing yield and reliability of electrical connections in light-emitting assemblies by simplifying the alignment process and ensuring consistent light emission.
Implementation Method 1
each light-emitting diode includes a first electrode, a second electrode, and a light-emitting layer between the first electrode and the second electrode
Data Source
AI summary
A light-emitting assembly with higher connection tolerances in manufacture includes a substrate, a light-emitting diode on the substrate, a transparent electrode, and a wire connected to the transparent electrode. The substrate includes a driving circuit connected to the light-emitting diode. The light-emitting diode includes a first electrode, a second electrode, and a light-emitting layer between the first electrode and the second electrode, the first electrode receiving the first driving signal. transparent electrode is connected to the second electrode. An orthographic projection area of the transparent electrode on the substrate is larger than an orthographic projection area of the second electrode on the substrate allowing less criticality in the alignment of signal wires for receiving the second driving signal. The light-emitting diode is configured to emit source light according to the first driving signal and the second driving signal.