Transparent Electrode Fabrication via Metallization Treatment
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Solution Overview
Problem
The existing methods for fabricating Advanced Super Dimension Switch (AD-SDS) type TFT-LCD array substrates require multiple patterning processes, leading to high fabrication costs and a need for reducing the number of patterning steps to enhance market competitiveness and reduce production costs.
Innovation Solution
A method involving the formation of a metal oxide film with semiconductor properties, where a portion is subjected to metallization treatment to form a first transparent electrode, and the remaining portion forms a semiconductor active layer, allowing for the creation of a multi-dimensional electric field using fewer patterning processes, including the use of etching barrier layers to protect metal oxide semiconductor materials and reduce damage during etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple patterning processes are used to form common electrode and other structures, then manufacturing precision is improved, but device complexity and production cost increase
Solution Approach 1:
The patent combines the formation of the common electrode and the pixel electrode into a single patterning process. By depositing a transparent conductive film that covers both the insulating layer and the semiconductor layer, and then patterning them simultaneously, the process reduces the number of separate patterning steps while maintaining the required precision for both structures.
Solution Approach 2:
The transparent conductive film serves multiple functions: it forms both the common electrode (on the insulating layer) and the pixel electrode (on the semiconductor layer) in a single deposition and patterning operation. This multi-functional approach eliminates the need for separate processes for each electrode type.
2Manufacturing precision
If multiple patterning processes are used to form common electrode and other structures, then manufacturing precision is improved, but productivity decreases
Solution Approach 1:
The patent combines the formation of the common electrode and the pixel electrode into a single patterning process. By depositing a transparent conductive film that covers both the insulating layer and the semiconductor layer, and then patterning them simultaneously, the process reduces the number of separate patterning steps while maintaining the required precision for both structures.
Solution Approach 2:
The transparent conductive film is deposited in advance to cover both the insulating layer and the semiconductor layer before any patterning occurs. This preliminary deposition ensures that both electrode structures are ready for simultaneous patterning, eliminating the need for separate deposition and patterning steps for each electrode.
3Ease of manufacture
If conventional patterning processes are used, then ease of manufacture is maintained, but loss of time increases
Solution Approach 1:
The patent combines the formation of the common electrode and the pixel electrode into a single patterning process. By depositing a transparent conductive film that covers both the insulating layer and the semiconductor layer, and then patterning them simultaneously, the process reduces the number of separate patterning steps while maintaining the required precision for both structures.
Solution Approach 2:
The single patterning process continuously forms both the common electrode and the pixel electrode in one uninterrupted operation. This continuous action eliminates the idle time and setup time that would occur between separate patterning processes, significantly reducing the total fabrication time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of patterning processes, lowers production costs, and ensures the quality of thin film transistors by protecting metal oxide semiconductor materials, thereby improving the efficiency and reliability of the AD-SDS type TFT-LCD array substrates.
Implementation Method 1
forming the first transparent electrode comprises: forming a metal oxide film presenting semiconductor properties; forming the first transparent electrode by subjecting a portion of the metal oxide film to metallization treatment
Data Source
AI summary
A method for fabricating array substrate, an array substrate and a display device. The method for fabricating the array substrate comprises forming a thin film transistor, a first transparent electrode (14) and a second transparent electrode (19), wherein a multi dimensional electric field is created by the first transparent electrode (17) and the second transparent electrode (19), wherein forming the first transparent electrode (17) comprises: forming a metal oxide film presenting semiconductor properties; forming the first transparent electrode (17) by subjecting a portion of the metal oxide film to metallization treatment, and forming a semiconductor active layer (141) from a portion which is not subjected to the metallization treatment.