Transparent Electrode Slit Geometry for Mura Reduction
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Solution Overview
Problem
Liquid crystal displays suffer from Mura phenomenon due to process variations during slit formation in the transparent conductive layer, leading to uneven brightness in pixels and poor display quality.
Innovation Solution
The electronic device incorporates a specific ratio of distance between adjacent finger portions to the width of the finger portions and a defined thickness of the insulating layer, adhering to the equation 1.450×X+0.877≤Y≤1.450×X+1.177, where X is the thickness in micrometers and Y is the ratio, to reduce the visibility and probability of Mura phenomenon.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If slits are formed in the transparent conductive layer to control gray scale values, then the display function is achieved, but process variations cause uneven brightness and Mura phenomenon
Solution Approach 1:
The patent applies parameter changes by establishing a specific mathematical relationship between the slit width (distance between finger portions) and the insulating layer thickness. By controlling the ratio Y = distance/width to satisfy the equation 1.450×X+0.877≤Y≤1.450×X+1.177 (where X is thickness in micrometers), the design compensates for process variations and achieves uniform brightness across different gray scale values.
2Manufacturing precision
If the slit dimensions are adjusted to compensate for process variation, then brightness uniformity improves, but the device complexity increases
Solution Approach 1:
The patent resolves the complexity issue by providing a clear mathematical formula that relates slit dimensions to insulating layer thickness. This parameter-based approach simplifies the design process compared to complex multi-parameter optimization, as manufacturers only need to control the ratio Y within the specified range rather than adjusting multiple independent parameters.
3Manufacturing precision
If stricter control on slit formation is implemented, then Mura phenomenon is reduced, but manufacturing difficulty increases
Solution Approach 1:
The patent makes manufacturing easier by establishing a direct proportional relationship between the slit width and insulating layer thickness. Instead of requiring independent control of multiple parameters, manufacturers simply need to ensure the ratio Y falls within the calculated range, which can be achieved through standard fabrication processes with conventional control.
Data Source
AI summary
An electronic device includes a substrate, a first transparent conductive layer disposed on the substrate, an insulating layer disposed on the first transparent conductive layer, and a second transparent conductive layer disposed on the insulating layer. The insulating layer has a thickness. The second transparent conductive layer has a transparent electrode including a plurality of finger portions, a connecting portion, and a slit. One of the finger portions has a width in a first direction, and the connecting portion connects the finger portions. The slit is disposed between two adjacent ones of the finger portions, and a distance is between the two adjacent ones of the finger portions in the first direction. A ratio of the distance and the width and the thickness complies with following equation: 1.450×X+0.877≤Y≤1.450×X+1.177, where X is the thickness in microns, and Y is the ratio of the distance and the width.