Transparent Electrode Sputtering Surface Curvature Control
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Solution Overview
Problem
Existing transparent electrode-equipped substrates face challenges in simultaneously achieving improved adhesion of lead-out wiring lines while maintaining conductivity and transparency, as amorphous conductive oxides used for adhesion enhancement compromise these properties.
Innovation Solution
A substrate with a transparent electrode layer formed by sputtering a metal oxide on a transparent substrate, where the surface treatment is conducted at a lower discharge power than deposition, with specific ratios of discharge power to deposition rate, resulting in a reduced average maximum curvature and enhanced adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an adhesion improving layer composed of amorphous conductive oxide is provided on a transparent electrode, then adhesion of lead-out wiring line is improved, but conductivity and transparency of the transparent electrode are deteriorated
Solution Approach 1:
The invention changes the surface parameters of the transparent electrode layer by controlling the average maximum curvature Ssc to be 5.4×10−4 nm−1 or less through specific sputtering conditions (deposition rate, discharge power, oxygen concentration). This parameter change improves adhesion of the lead-out wiring line while maintaining the crystalline structure and electrical/optical properties of the transparent electrode, avoiding the need for amorphous conductive oxide layers.
2Area of stationary object
If the frame area of display and touch panel is narrowed, then device integration is improved, but the area for connecting lead-out wiring line and transparent electrode is reduced, making adhesion improvement difficult
Solution Approach 1:
By controlling the surface morphology parameters (average maximum curvature Ssc) of the transparent electrode layer through optimized sputtering conditions, the invention achieves excellent adhesion even in reduced frame areas. The specific parameters (deposition rate, discharge power, oxygen concentration) create a surface that enhances wiring line adhesion without requiring additional area or adhesion layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves excellent adhesion between the transparent electrode and lead-out wiring lines while maintaining conductivity and transparency, improving the overall performance of the substrate.
Implementation Method 1
the transparent electrode is formed by a sputtering method
Implementation Method 2
carrying out a step of applying a second discharge power x2 to a sputtering target to surface-treat the transparent electrode layer
Data Source
AI summary
A transparent electrode-equipped substrate includes a metal oxide transparent electrode layer on a transparent substrate. The average maximum curvature Ssc of the surface of the transparent electrode layer is preferably 5.4×10−4 nm−1 or less. For example, if the transparent electrode layer is subjected to a surface treatment by low discharge-power sputtering after deposition, the Ssc of the transparent electrode layer can be reduced. This transparent electrode-equipped substrate excels in close adhesion between the transparent electrode layer and a lead-out wiring line disposed on the transparent electrode layer. The transparent electrode layer is obtained by, for example, performing a transparent electrode deposition step of through the application of a first discharge power and then performing a surface treatment step through the application of a second discharge power.