Transparent Electronic Device Wiring via Substrate Overlap
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Solution Overview
Problem
The challenge in transparent electronic devices is the increased area and reduced yield due to the opaque power feeder connecting to the edge of the device, which lengthens the routing distance of fine wiring, especially when the electronic element's arrangement in transparent members like windows affects the positioning of the power feeder.
Innovation Solution
A transparent electronic device configuration where the electronic element is formed on one transparent insulating substrate, and the power feeder is connected to another substrate with a flexible wiring board, allowing the wirings to overlap and connect electrically, reducing the visible area and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the opaque power feeder is connected to the edge part of the transparent electronic device, then the power can be fed to the electronic element, but the routing distance of the fine wiring increases and the area of the transparent electronic device increases
Solution Approach 1:
The patent applies dimensionality change by moving the electronic element from the same plane as the power feeder to a different plane (the transparent insulating substrate). The fine wiring routes from the edge part on the power feeder plane, through the transparent substrate, to reach the electronic element on the substrate plane. This spatial reorganization reduces the routing distance and minimizes the area occupied by the transparent electronic device while maintaining reliable power feeding capability.
2Reliability
If the opaque power feeder is connected to the edge part of the transparent electronic device, then the power can be fed to the electronic element, but the routing distance of the fine wiring increases and the yield of the transparent electronic device declines
Solution Approach 1:
By relocating the electronic element to the transparent insulating substrate plane rather than keeping it on the same plane as the power feeder, the patent reduces the routing distance of fine wiring. This dimensional reorganization simplifies the wiring layout, reduces potential connection points for defects, and improves manufacturing yield while maintaining effective power feeding to the electronic element.
3Area of stationary object
If the electronic element is formed on the transparent insulating substrate, then the visible area is minimized and visibility of the rear-face side is maintained, but the power feeder connection becomes more complex
Solution Approach 1:
The patent resolves the complexity issue by utilizing the transparent insulating substrate as an intermediate plane that naturally accommodates both the power feeder connection at the edge and the electronic element on the surface. The fine wiring serves as a bridge between these two planes, creating a straightforward three-dimensional connection structure that minimizes visible area while avoiding complex routing arrangements.
Solution Approach 2:
The transparent insulating substrate acts as an intermediary between the opaque power feeder and the electronic element. It provides a platform for receiving the fine wiring from the edge part while supporting the electronic element on its surface, thereby simplifying the overall connection structure and reducing visible area without increasing device complexity.
4Area of stationary object
If the electronic element area is reduced to 250,000 μm2 or less, then the visibility of the rear-face side is improved, but the power feeding and wiring become more challenging
Solution Approach 1:
By placing the electronic element on the transparent insulating substrate plane rather than on the same plane as the power feeder, the patent creates a favorable spatial arrangement for power feeding. The fine wiring can route from the edge part through the substrate to reach the small electronic element, making the wiring process more manageable despite the reduced element size and improving rear-face visibility.
Solution Approach 2:
The transparent insulating substrate serves as a mediator that facilitates power feeding to small electronic elements (250,000 μm2 or less). It provides a stable platform for mounting these small elements while allowing fine wiring to be routed from the edge part, thereby simplifying the manufacturing process despite the challenging small size of the electronic elements.
Data Source
AI summary
A transparent electronic device, including: a transparent insulating substrate (TIS); an electronic element which is formed on a main surface of the TIS and which has an area of 250,000 μm2 or less; and an opaque power feeder configured to feed power to the electronic element. The electronic element is a light-emitting diode element or a sensor. The TIS includes: a first TIS with the electronic element and a first wiring connected to the electronic element being formed on one main surface; and a second TIS with a second wiring being formed on one main surface, the electronic element is not formed on the second TIS, and one end of the first wiring and one end of the second wiring are electrically connected to each other and the opaque power feeder is connected to another end of the second wiring in an edge part of the second TIS.