Transparent Electrostatic Carrier for High-Temperature Substrate Handling
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Solution Overview
Problem
Existing electrostatic carriers are not suitable for high-temperature semiconductor processes and are not cost-effective, leading to lower throughput due to inefficient substrate release and yield loss, and they are not designed for high-temperature applications above 450 degrees C.
Innovation Solution
An electrostatic carrier with a transparent body and electrodes made from transparent conductive oxide materials, such as indium-tin oxide, which allows for radiation-assisted release techniques like photo-enhanced conductivity and thermally enhanced conductivity to facilitate substrate dechucking, enabling operation at high temperatures and reducing residual charges for quick substrate release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional electrostatic carriers are used, then substrates can be held during processing, but they cannot be used in high temperature processes (above 450 degrees C.) and do not release substrates immediately after processing
Solution Approach 1:
The patent changes the material parameter of the electrode from traditional metals to transparent conductive oxide (TCO) materials, which have different thermal and electrical properties. This material substitution enables the carrier to withstand high temperatures above 450°C while maintaining electrostatic functionality, and allows immediate substrate release after processing by controlling the electrostatic charge dissipation
2Strength
If mechanical clamping is used to hold substrates, then substrates can be secured during processing, but unwanted particles are introduced and yield loss increases
Solution Approach 1:
The patent replaces the mechanical clamping system with an electrostatic field-based holding system. The electrostatic carrier uses electric fields to attract and hold substrates without physical contact or mechanical force, thereby eliminating particle contamination from mechanical components and avoiding yield loss associated with mechanical handling
3Strength
If gluing is used to attach substrates to carriers, then substrates can be secured, but resource consumption increases and residue/m mechanical stress is caused during detachment
Solution Approach 1:
The patent replaces the chemical gluing system with an electrostatic field-based attachment system. This eliminates the need for adhesives, reducing resource consumption and eliminating residue and mechanical stress problems. The electrostatic field provides secure attachment during processing and allows clean, stress-free release by simply dissipating the charge
Solution Approach 2:
The electrostatic carrier can be reused multiple times without degradation, eliminating the need for disposable adhesive materials. The electrostatic field itself acts as a temporary, reusable attachment mechanism that requires no material consumption beyond the electrical energy to maintain the field
4Reliability
If existing electrostatic carriers are used, then substrates can be held during processing, but substrate release is delayed and throughput decreases
Solution Approach 1:
The patent implements dynamic control of the electrostatic field to enable immediate substrate release. By dynamically adjusting the electrical bias on the TCO electrode, the carrier can transition from a strong holding state during processing to an immediate release state after processing, eliminating delays and maximizing throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electrostatic carrier effectively secures substrates at high temperatures and rapidly releases them, increasing throughput and reducing costs by using transparent conductive oxide electrodes that mitigate thermal stress and allow for efficient dechucking within seconds.
Implementation Method 1
The electrostatic carrier uses an electrostatic force to secure the substrate thereto
Implementation Method 2
exposing an electrostatic chucking electrode of the electrostatic carrier to electromagnetic radiation sufficient to neutralize an electrostatic charge generated by the electrostatic chucking electrodes
Implementation Method 3
photo-enhanced conductivity and thermally enhanced conductivity to facilitate substrate dechucking
Data Source
AI summary
Embodiments described herein provide an electrostatic carrier for transferring a substrate. The electrostatic carrier may have a transparent body. The transparent body may have a first surface sized to transport the substrate into and out of a processing chamber. The electrostatic carrier may also have one or more electrostatic chucking electrodes coupled to the transparent body. The one or more electrostatic chucking electrodes may include a transparent conductive oxide material. In certain embodiments the transparent conductive oxide material is an indium-tin oxide material.