Transparent Emitter Thermophotovoltaic Module with Micron-Gap

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Solution Overview

Problem

Existing energy conversion systems face inefficiencies in converting heat into power, particularly in maintaining stable micron-gaps for effective radiative energy transfer in thermophotovoltaic modules, which affects the overall energy conversion efficiency.

Innovation Solution

A thermophotovoltaic panel assembly with a heat sink and thermophotovoltaic modules separated by a micron-gap, where the emitter is fastened to the heat sink using a force application layer, and a base substrate with excellent thermal conductivity is used to maintain the gap, ensuring efficient radiative energy transfer and conversion into electricity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the emitter is placed in direct physical contact with the housing through a thermal interface material, then thermal conduction is improved, but the stability and precision of the micron-gap are compromised

Engineering Contradiction:

Improvethermal conductionVSAvoidmicron-gap stability

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent introduces a thermal interface material as an intermediary substance between the emitter and housing. This material serves as a mediator that facilitates thermal energy transfer while allowing the emitter to maintain a precise, stable micron-gap distance from the housing surface, thus resolving the contradiction between thermal conduction efficiency and gap stability.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Loss of energy

If the gap between emitter and photovoltaic element is reduced to sub-micron level, then radiative energy transfer efficiency is improved, but the complexity of maintaining the gap increases

Engineering Contradiction:

Improveradiative energy transfer efficiencyVSAvoidgap maintenance complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical adjustment mechanisms with a vacuum environment and elastic force application. The vacuum eliminates convective heat transfer and reduces gas molecule interference, while elastic forces applied through the housing structure automatically maintain the sub-micron gap without requiring complex mechanical adjustment systems, thus reducing device complexity while achieving high energy transfer efficiency.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Loss of energy

If the housing is evacuated to maintain vacuum, then convective heat transfer is minimized, but the manufacturing and sealing complexity increases

Engineering Contradiction:

Improveconvective heat transfer minimizationVSAvoidvacuum sealing complexity

Core Design Contradiction:

Loss of energyVSEase of manufacture

Solution Approach 1:

The patent merges the vacuum chamber housing with the structural support and force application mechanism into a single integrated component. The housing simultaneously serves as the vacuum seal, the structural element that applies elastic force to maintain the gap, and the mounting structure for the emitter and photovoltaic element. This consolidation reduces manufacturing steps and simplifies the overall device assembly while maintaining the vacuum environment for minimal convective heat transfer.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances energy conversion efficiency by maintaining a stable micron-gap, minimizing thermal conduction and convective heat transfer, and allowing for effective energy transfer from the emitter to the photovoltaic element, thereby improving power generation capabilities.

Implementation Method 1

the housing absorbs energy and, thereby, radiates energy to the emitter assembly

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 2

the emitter assembly absorbs energy

Methodology Applied

Scientific EffectAbsorption of electromagnetic radiation: Absorption (EM radiation)

Implementation Method 3

emits energy across the gap for conversion into electricity by the photovoltaic element assembly

Methodology Applied

Scientific EffectPhotovoltaic effect: Photovoltaic Effect

Data Source

PatentUS11264938B2Radiative micron-gap thermophotovoltaic system with transparent emitter

Publication Date: 2022.03.01 MTPV POWER CORP

AI summary

A thermophotovoltaic panel assembly including a heat sink and a plurality of thermophotovoltaic modules mounted on the heat sink. Each thermophotovoltaic module includes a photovoltaic element separated from an emitter assembly by a gap. The emitter assembly includes an emitter and applies force towards the photovoltaic element to maintain the gap. The thermophotovoltaic panel assembly may also utilize a force application layer on the emitter and be bolted in place. A housing can be used for protection and to transfer energy to the emitter. The heat sink cantilevers into the housing to define a space between the thermophotovoltaic modules and the inner surface of the housing. Preferably, the housing maintains a vacuum and, in turn, the gap is evacuated. The heat sink can be monolithic and cooled with fluid pumped therethrough. The emitter may be transparent or at least partially transmissive.