Transparent Encapsulation for IC Alignment and Reliability
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Solution Overview
Problem
The electronic industry faces challenges in creating integrated circuit packaging systems that are smaller, more reliable, and cost-effective while maintaining increased integration and functionality, as existing solutions have not adequately addressed the need for reduced size, improved reliability, and lower costs.
Innovation Solution
A method involving the formation of a substrate with redistribution lines, mounting an integrated circuit, and applying a transparent encapsulation that covers the circuit and lines, allowing visibility through the encapsulation for improved alignment and protection, thereby enhancing reliability and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional opaque encapsulation is used, then manufacturing cost is reduced, but alignment precision in subsequent processes deteriorates
Solution Approach 1:
The encapsulation material is formulated to be transparent rather than opaque, changing its optical property from light-blocking to light-transmitting. This allows alignment marks and features to be visually observed through the encapsulation during subsequent manufacturing processes, improving alignment precision without requiring additional costly alignment procedures or mark structures.
2Area of stationary object
If package size is reduced to meet miniaturization requirements, then device footprint is decreased, but reliability deteriorates due to increased stress and damage risk
Solution Approach 1:
The encapsulation employs a composite material system comprising a transparent polymer matrix reinforced with dispersible filler particles. This composite structure provides enhanced mechanical strength and stress distribution while maintaining the compact package size, thereby improving reliability without increasing footprint.
Solution Approach 2:
The encapsulation material is specifically designed to provide mechanical cushioning and stress distribution before damage can occur to the semiconductor die. The material's viscoelastic properties allow it to absorb and distribute mechanical stresses, protecting the internal components from damage during handling and operation in the miniaturized package.
3Ease of manufacture
If temporary bonding is used during manufacturing, then ease of assembly is improved, but manufacturing cost increases and reliability deteriorates
Solution Approach 1:
The encapsulation is designed to provide permanent mechanical support and structural stability from the outset, eliminating the need for temporary bonding procedures. The material's adhesive and mechanical properties are optimized to secure components permanently during and after the molding process, removing the subsequent step of temporary bond removal and associated reliability risks.
Solution Approach 2:
The invention extracts and eliminates the temporary bonding step from the manufacturing process entirely. By designing the encapsulation material and molding process to provide sufficient mechanical support and adhesion during assembly, the unnecessary and potentially harmful temporary bonding operation is removed from the process sequence.
4Adaptability or versatility
If integration density is increased to reduce package footprint, then device functionality is enhanced, but manufacturing complexity increases
Solution Approach 1:
The transparent encapsulation serves multiple functions simultaneously: it provides mechanical protection, enables visual alignment, offers stress distribution, and allows optical inspection. This multi-functionality simplifies the manufacturing process for high-density integrated packages by eliminating the need for separate operations to achieve these functions, thereby reducing manufacturing complexity despite increased integration density.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a substrate having a redistribution line thereon; mounting an integrated circuit to the substrate; and molding a transparent encapsulation over the substrate covering the integrated circuit and the redistribution line and the integrated circuit seen through the transparent encapsulation.