Transparent Glass Substrate for High-Precision Semiconductor Mounting
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Solution Overview
Problem
Conventional semiconductor device manufacturing techniques face challenges in achieving high precision chip mounting, substrate flatness, and cost-effectiveness due to warping, swelling, and the need for positioning marks, which can lead to connection defects and increased processing costs.
Innovation Solution
A semiconductor device is manufactured using a transparent glass board with minimal warping, where the semiconductor element is mounted face-up and an insulation layer seals the electrode terminal, allowing for precise positioning without positioning marks on the substrate, and the transparent board is easily removable or integrated, enabling high-density, thin-profile devices at low cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a resin or metal substrate is used for mounting semiconductor elements, then the substrate can support chip mounting, but warping, swelling, and lack of flatness occur making high precision mounting difficult
Solution Approach 1:
A transparent board is introduced as an intermediary substrate between the semiconductor element and the final device structure. This transparent board provides a stable, flat mounting surface that prevents warping and swelling issues associated with resin or metal substrates, while enabling precise positioning of the semiconductor element through its transparency for visual alignment.
Solution Approach 2:
The invention changes the material parameter of the substrate from conventional resin or metal to a transparent board material that exhibits superior dimensional stability. This parameter change eliminates warping and swelling, providing a flat surface that maintains precision during the manufacturing process.
2Manufacturing precision
If positioning marks are provided on the substrate for chip mounting, then positioning accuracy is improved, but manufacturing cost increases
Solution Approach 1:
The transparent board acts as a visual intermediary that allows operators to directly observe and align the semiconductor element with the substrate without requiring additional positioning marks. The transparency enables visual positioning, eliminating the need for separate marking steps and reducing manufacturing complexity.
3Strength
If the substrate is metal, then structural strength is improved, but etching is required to remove the substrate after manufacturing increasing processing cost
Solution Approach 1:
The transparent board is designed as a temporary, disposable substrate that serves its purpose during manufacturing and then is easily removed. It provides sufficient strength during the mounting process but eliminates the need for complex etching operations required when using permanent metal substrates, reducing overall processing complexity.
Solution Approach 2:
The transparent board is extracted or removed from the final device structure after serving its mounting function. This extraction eliminates the need for additional processing steps to remove permanent substrates, simplifying the manufacturing process while maintaining structural integrity during assembly.
4Productivity
If conventional embedding techniques are used, then high density packaging is achieved, but positioning marks create non-flat surfaces that originate cracks reducing reliability
Solution Approach 1:
The transparent board serves as a smooth intermediary surface that allows high-density packaging without creating surface irregularities. By enabling visual alignment without positioning marks, it prevents the formation of non-flat surfaces that would otherwise originate cracks and compromise device reliability.
Data Source
AI summary
A transparent board is positioned on a support board provided with a positioning mark, and a release material is provided. A semiconductor element is then positioned so that the electrode element faces upward, and the support board is then removed. An insulating resin is then formed on the release material so as to cover the semiconductor element; and a via, a wiring layer, an insulation layer, an external terminal, and a solder resist are then formed. The transparent board is then peeled from the semiconductor device through the use of the release material. A chip can thereby be mounted with high precision, there is no need to provide a positioning mark during mounting of the chip on the substrate in the manufacturing process, and the substrate can easily be removed. As a result, a semiconductor device having high density and a thin profile can be manufactured at low cost.