Transparent Heat Sink Structure for Electro-Optical Cooling
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Solution Overview
Problem
Electro-optical devices face challenges in effectively dissipating heat generated during operation, leading to potential failure due to excessive junction temperatures.
Innovation Solution
Incorporation of a heat sink mechanically coupled to a transparent layer and electronic circuitry, with pillars and fins to enhance thermal conductivity and dissipation, and use of conductive materials to reduce thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is mechanically coupled to electronic circuitry to dissipate heat, then thermal dissipation is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat sink with the transparent layer by mechanically coupling them together, creating an integrated structure that serves both optical and thermal management functions simultaneously. This reduces the number of separate components while achieving effective heat dissipation from the electronic circuitry.
Solution Approach 2:
The heat sink structure is designed to perform multiple functions: it dissipates heat from the electronic circuitry, provides mechanical support, and maintains the structural integrity of the device. This multi-functionality reduces overall device complexity by eliminating the need for separate components for each function.
2Temperature
If pillars and fins are added to enhance thermal conductivity and dissipation, then thermal dissipation is improved, but device complexity increases
Solution Approach 1:
The patent adds fins to the heat sink structure, extending the thermal management solution into a third dimension. These fins increase the surface area for heat dissipation without significantly complicating the base structure, as they are integrated extensions of the existing heat sink geometry.
Solution Approach 2:
The heat sink is divided into multiple sections with pillars and fins that create distinct thermal pathways. This segmentation allows heat to be distributed and dissipated more efficiently across multiple surfaces and directions, improving thermal management while maintaining a structured, organized design.
3Temperature
If conductive materials are used to reduce thermal resistance, then thermal dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs composite material structures in the heat sink and connecting elements, combining materials with different thermal and mechanical properties. This allows optimization of thermal conductivity in critical pathways while maintaining manufacturability through established composite material fabrication techniques.
Solution Approach 2:
The patent optimizes the thermal and mechanical parameters of the conductive materials used in pillars and heat sink structures. By carefully selecting and tuning material parameters such as thermal conductivity, conductivity, and mechanical strength, the design achieves low thermal resistance while remaining compatible with standard manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Maintains junction temperatures below critical thresholds, preventing device failure and enhancing mechanical robustness through improved thermal management.
Implementation Method 1
a first pillar configured to mechanically couple the first heat sink section to the electronic circuitry, and transfer heat generated by the electronic circuitry to the first heat sink section
Implementation Method 2
the one or more first fins and the one or more second fins are configured to increase a thermal exchange surface between the heat sink and an environment, and increase a thermal dissipation of the heat sink
Implementation Method 3
the first pillar and the second pillar comprise heat conductive glue
Data Source
AI summary
In various embodiments, an electro-optical device is provided. The electro-optical device includes a transparent layer. The electro-optical device also includes a heat sink mechanically coupled to and embedding the transparent layer, where the heat sink includes a first heat sink section, and a second heat sink section. The electro-optical device also includes an electronic circuitry disposed on a substrate, a first pillar configured to mechanically couple the first heat sink section to the electronic circuitry and transfer heat generated by the electronic circuitry to the first heat sink section, and a second pillar configured to mechanically couple the second heat sink sections to the electronic circuitry and transfer heat generated by the electronic circuitry to the second heat sink section.