Transparent Heating Plate for Optical Testing of Light Emitting Chips
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Solution Overview
Problem
Current optical test equipment for light emitting chips on wafers before dicing cannot heat the chips during testing, limiting the ability to assess light emitting efficiency at specific high temperatures.
Innovation Solution
An optical test equipment with a heating function, featuring a transparent heating plate that supports the wafer, allows light to pass through, and is powered to generate heat, combined with a probing device and temperature control units to maintain specific temperature conditions for testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional probing apparatus is used for optical test of light emitting chips on a wafer, then the testing process can be performed on multiple chips simultaneously, but the chips cannot be heated during the test
Solution Approach 1:
The patent combines the heating function and optical testing function into a single integrated system. The transparent heating plate serves dual purposes: it acts as a support substrate for the wafer and simultaneously functions as a heating element that allows light transmission. This merging of functions enables temperature control during optical testing without requiring separate heating equipment.
Solution Approach 2:
The transparent heating plate is designed to perform multiple functions: supporting the wafer, heating the chips to specific temperatures, and allowing light to pass through for optical detection. This multi-functional design enables the system to conduct comprehensive temperature-dependent optical testing without additional specialized equipment.
2Adaptability or versatility
If a transparent heating plate is introduced to enable heating during testing, then chips can be tested at specific high temperatures, but the device structure becomes more complex
Solution Approach 1:
The heating function is localized to the transparent heating plate that directly contacts the wafer, rather than requiring a completely redesigned testing environment. This localized approach allows temperature control to be implemented in the specific area where chips are tested, minimizing overall system complexity while achieving the desired functionality.
Solution Approach 2:
The transparent heating plate acts as an intermediary element between the wafer and the testing system. It mediates between the need for heating and the need for optical transparency, allowing both requirements to be satisfied simultaneously without fundamentally redesigning the entire testing apparatus.
3Stability of the object's composition
If the transparent heating plate is used to heat the wafer, then uniform temperature distribution can be achieved, but light transmission may be affected
Solution Approach 1:
The patent selects specific material parameters for the transparent heating plate, including its transparency characteristics and thermal conductivity, to optimize both light transmission and heating uniformity. By carefully controlling these material parameters, the system achieves a balance where the plate remains sufficiently transparent for optical detection while providing uniform heating across the wafer surface.
Solution Approach 2:
The transparent heating plate is made from composite or specially formulated materials that combine optical transparency with heating capabilities. This allows the plate to simultaneously transmit light for optical detection and generate uniform heat for temperature-controlled testing, resolving the contradiction between these two requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables light emitting efficiency testing of light emitting chips on wafers before dicing while heating them, simulating practical temperature conditions to assess efficiency under heat-generated scenarios, ensuring accurate and uniform testing results.
Implementation Method 1
The transparent heating plate is adapted for allowing light to pass through the top surface and the bottom surface thereof and capable of being powered to generate heat to heat the wafer
Implementation Method 2
The transparent heating plate is adapted for allowing light to pass through the top surface and the bottom surface thereof
Data Source
AI summary
An optical test equipment includes a chuck, a light receiving device corresponding in position to an opening of the chuck, a transparent heating plate disposed on the chuck or light receiving device in a way that the bottom surface of the transparent heating plate faces toward the light receiving device for a wafer to be disposed on the top surface of the transparent heating plate, allowing light to pass through the top and bottom surfaces and being powered to generate heat to heat the wafer, and a probing device including a seat and a probe protruding from the seat toward the top surface of the transparent heating plate for probing a light emitting chip of the wafer. The equipment can perform light emitting efficiency test to the light emitting chip on the wafer before dicing and heat the light emitting chip at the same time.