Transparent IC Card Structure With Print Layer for Stable NFC Design
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Solution Overview
Problem
There is a need for a technology that enhances the design quality of contactless communication media, including IC chips, while maintaining efficient production and communication performance.
Innovation Solution
A contactless communication medium comprising an IC module housed in a concave portion of a transparent resin member, with a print layer between two transparent resin members, and optionally a lid member, allowing for high design quality and efficient production without the need for complex molds or adjustments in antenna and tuned circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a transparent resin material is used for the card body to reduce production costs and enable identification from both surfaces, then manufacturing cost is reduced and identification performance is improved, but design quality is insufficient
Solution Approach 1:
The card body is divided into multiple transparent resin members (first transparent resin member and second transparent resin member) that are bonded together. This segmentation allows each member to have specific functions (IC module accommodation, print layer integration) while maintaining overall transparency and aesthetic quality, resolving the contradiction between simple manufacturing and high design quality.
Solution Approach 2:
The invention uses composite structures of multiple transparent resin members bonded together, creating a multi-layer transparent composite material system. This allows integration of functional elements (IC module, print layer) within the transparent structure, achieving both manufacturing efficiency and high design quality through material composition rather than complex single-material processing.
2Shape
If different colors and patterns are applied to card bodies to improve design quality, then design quality is improved, but production cost increases due to different resin materials and metal molds for each color
Solution Approach 1:
The transparent resin members serve multiple functions: they provide the structural card body, enable aesthetic transparency, accommodate functional IC modules, and integrate print layers for design customization. This multi-functionality eliminates the need for separate manufacturing processes for different colors, allowing design customization without increasing production costs.
Solution Approach 2:
Instead of creating different physical molds for each color, the invention uses print layers that can be digitally customized and applied to the same transparent resin structure. This copying approach allows infinite design variations without requiring physical mold changes, maintaining low production costs while achieving high design quality.
3Shape
If various shapes and designs are created for contactless communication media to improve design quality, then design quality is improved, but communication performance varies and frequent communication tests are required
Solution Approach 1:
The IC module is accommodated in a dedicated concave portion of the first transparent resin member, isolating the communication function to a specific localized area. This local quality approach ensures that the antenna and tuned circuits maintain consistent positioning and orientation regardless of the overall card shape or design, thereby maintaining communication performance consistency across various designs.
Solution Approach 2:
The card structure is segmented into functional zones: the first transparent resin member with concave portion for IC module accommodation, the print layer for design, and the second transparent resin member for completion. This segmentation allows the communication function to be isolated and standardized while the aesthetic design elements can vary freely, ensuring communication performance consistency across different designs.
Data Source
AI summary
A contactless communication medium according to an embodiment of the present technology includes an IC module, a first member, a second member, and a print layer. The IC module is capable of performing a contactless communication. The first member is made of a first transparent resin material, the first member including a first surface and a second surface, the first surface being a surface in which a concave portion that accommodates therein the IC module is formed, the second surface being situated opposite to the first surface. The second member is made of a second transparent resin material, the second member being connected to the first surface or the second surface. The print layer is arranged between the first member and the second member.