Transparent Interposer Lens Arrays for WDM Optical Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Wavelength-division multiplexing systems face challenges with angular misalignment issues due to high aspect ratio optoelectronic devices, leading to beam pointing errors and reduced coupling efficiency with WDM optical connectors.
Innovation Solution
The use of low aspect ratio optoelectronic device assemblies, such as top emitting VCSELs and surface illuminated photodetectors, which are flip chip solder reflowed onto transparent interposers and substrates, allowing for self-alignment and improved optical coupling through the integration of optical sockets and lens arrays, thereby minimizing angular misalignment and enhancing coupling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If high aspect ratio optoelectronic devices are used, then device integration is achieved, but angular misalignment and beam pointing errors occur
Solution Approach 1:
The patent introduces an interposer as an intermediary component between the optoelectronic device and the substrate. This interposer provides a stable mounting platform that enables precise alignment and positioning, thereby reducing angular misalignment and beam pointing errors while maintaining device integration capability.
Solution Approach 2:
The patent segments the optoelectronic device into multiple components: the device itself, the interposer for mounting and alignment, and the substrate for support. This segmentation allows each component to be optimized independently, with the interposer specifically addressing the alignment precision issue without compromising overall integration.
2Reliability
If complex optoelectronic assemblies are used, then optical coupling efficiency is improved, but thermal management becomes difficult
Solution Approach 1:
The patent extracts the thermal management function from the complex optoelectronic assembly by providing a separate substrate with dedicated thermal management capabilities. This allows the optical coupling components to be optimized for their primary function while the substrate handles heat dissipation independently.
3Quantity of substance
If optoelectronic devices are mounted directly to substrates, then device density is increased, but alignment precision is reduced
Solution Approach 1:
The interposer serves as a mediator between the optoelectronic device and substrate, providing a stable platform for precise alignment. This intermediary structure enables accurate positioning of multiple devices, maintaining high alignment precision while allowing increased device density through the stable mounting platform.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the coupling efficiency between optoelectronic devices and WDM optical connectors, simplifies thermal management, and allows for independent design considerations of optomechanical components, reducing beam pointing errors and increasing the reliability of WDM systems.
Implementation Method 1
flip chip solder reflowed onto transparent interposers
Implementation Method 2
flip chip solder reflowed onto transparent interposers
Implementation Method 3
transparent interposers and substrates, allowing for self-alignment and improved optical coupling
Implementation Method 4
improved optical coupling through the integration of optical sockets and lens arrays
Data Source
AI summary
Example implementations relate to mounting optoelectronic devices and wavelength-division multiplexing optical connectors. For example, an implementation includes a transparent interposer having an integrated plurality of lenses. A plurality of optoelectronic devices are mounted to a bottom surface of the transparent interposer, each of the optoelectronic devices being paired to a respective lens of the plurality of lenses. The bottom surface of the transparent interposer is mounted to a substrate within a region of an optical socket. The optical socket receives a filter-based wavelength-division multiplexing (WDM) optical connector. Each lens of the plurality of lenses is paired to a respective filter of the WDM optical connector when the WDM optical connector is mated to the optical socket.