Transparent Workpiece Separation Using Multi-Focus Laser Etching
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Solution Overview
Problem
Existing methods for severing transparent materials using laser beams are inefficient in terms of speed and precision, particularly when it comes to forming beveled edges or precise parting surfaces.
Innovation Solution
The method involves creating multiple focus elements using an input laser beam, applying these focus elements to the transparent material to form material modifications along a predetermined processing line, and then using a wet chemical solution at a controlled temperature for etching to sever the material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single laser beam is used to sever transparent material, then the material can be modified along a processing line, but the etching rate is slow and the process time is long
Solution Approach 1:
The single laser beam is divided into multiple parallel beams using a beam splitter, and each beam is focused to create multiple focal points along the processing line. This segmentation allows simultaneous modification of multiple points in the material, significantly increasing the etching rate and reducing the overall process time while maintaining precision.
2Productivity
If multiple parallel laser beams are used to increase etching speed, then productivity improves, but beam control and focus precision become more difficult
Solution Approach 1:
A single beam splitter component performs the function of dividing the laser beam into multiple parallel beams, and a single focusing lens focuses all beams simultaneously. This multi-functional approach increases productivity through parallel processing while avoiding the complexity of controlling multiple independent laser sources or focusing mechanisms.
3Productivity
If high temperature etching is used to increase etching rate, then productivity improves, but thermal damage to surrounding material increases
Solution Approach 1:
The laser beams are focused to create highly localized material modifications only at the focal points along the processing line. The chemical etching solution then acts selectively on these modified regions. This localized approach enables high etching rates at the target areas while minimizing thermal damage to surrounding unmodified material, as the heat input is concentrated only where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for faster and more precise severing of transparent materials, achieving a higher etching rate at the material modifications while minimizing etching in unmodified regions, thus reducing the overall time required for the process.
Implementation Method 1
a focal zone of a single pulse of the laser beam that is elongated in the beam propagation direction being made to interact with the material and the interaction of the single pulse with the material creating a channel
Implementation Method 2
creating a channel that passes through the material from a first end face to a second end face
Implementation Method 3
severing the material along the processing line by an etching process using a wet chemical solution
Data Source
AI summary
A method for severing a workpiece having a transparent material includes providing multiple focus elements using an input laser beam, applying the multiple focus elements to the material, thereby forming material modifications in the material along a predetermined processing line, and severing the material along the processing line by an etching process using a wet chemical solution. A temperature of the wet chemical solution during the etching process is at least 100° C. and/or at most 150° C.