Transparent Component Laser Welding for Adhesive-Free Enclosures
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Solution Overview
Problem
Conventional electronic devices rely on adhesives to couple components to the housing, which can lead to operational issues due to adhesive wear, increased manufacturing time and cost, and aesthetic concerns, especially with hard materials like sapphire.
Innovation Solution
Laser welding is used to directly couple transparent components to the enclosure, eliminating the need for adhesives and creating a permanent, hidden weld that enhances both coupling strength and cosmetic appeal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive is used to couple components to the housing, then components can be assembled to the housing, but the adhesive may wear or weaken over time causing components to become displaced
Solution Approach 1:
The patent removes the adhesive layer from the coupling system entirely, replacing it with a direct mechanical interference fit between the component and housing. This extraction of the adhesive intermediary eliminates the reliability issues associated with adhesive degradation over time.
Solution Approach 2:
The patent replaces the chemical bonding mechanism (adhesive) with a mechanical bonding mechanism (interference fit). The component features a protrusion that fits into a recess in the housing, creating a mechanical lock that does not degrade over time like adhesive.
2Manufacturing precision
If contact surfaces are treated (planed, polished, resurfaced) to ensure adequate contact for adhesive bonding, then adhesive bonding effectiveness is improved, but manufacturing time increases
Solution Approach 1:
The patent removes the requirement for surface treatment operations by eliminating the adhesive bonding process. The interference fit mechanism does not depend on surface quality for bonding effectiveness, thereby eliminating the time-consuming planing, polishing, and resurfacing operations.
Solution Approach 2:
The patent replaces the adhesive-based bonding system (which requires precise surface preparation) with a mechanical interference fit system that is more tolerant of surface variations and does not require extensive surface treatment.
3Manufacturing precision
If additional cutting or shaping processes are performed on hard materials like sapphire to minimize defects, then contact surface quality is improved, but manufacturing time and cost increase
Solution Approach 1:
The patent removes the requirement for additional cutting and shaping processes on hard materials by eliminating the adhesive bonding step that necessitated such precise surface preparation. The interference fit can accommodate minor surface defects without compromising the bonding relationship.
4Ease of manufacture
If adhesive is used to couple components to the housing, then components can be assembled to the housing, but manufacturing cost increases due to adhesive material and application time
Solution Approach 1:
The patent removes the adhesive material cost and the labor cost associated with adhesive application and curing. The interference fit mechanism uses the existing component and housing geometries without requiring additional materials or extended assembly time.
5Ease of manufacture
If adhesive is used to couple components to the housing, then components can be assembled to the housing, but cosmetic appearance deteriorates due to visible adhesive
Solution Approach 1:
The patent removes the visible adhesive layer by eliminating the adhesive bonding process entirely. The interference fit creates a clean, flush interface between the component and housing with no visible bonding material, thereby improving cosmetic appearance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laser welding method provides a strong, permanent coupling between components and the enclosure, reduces manufacturing time and costs, and improves the aesthetic appearance by concealing the weld, addressing the limitations of adhesive-based coupling.
Implementation Method 1
The second component is positioned within the aperture of the first component and is laser welded directly to the first component
Implementation Method 2
a laser is positioned above the first and second component and emits a beam through the second component, including the transparent material, to the first component
Data Source
Figure 1A
Figure 1B
Figure 2A
AI summary
Welding of transparent material in electronic devices. An electronic device (100) may include an enclosure (102) having at least one aperture formed through a portion of the enclosure (102). The electronic device (100) may also include a component (104) positioned within the aperture formed through the portion of the enclosure. The component (104) may be laser welded to the aperture formed through the enclosure. Additionally, the component (104) may include transparent material. A method for securing a component within an electronic device (100) may include providing an electronic device enclosure including at least one aperture, and positioning a component (104) within the aperture formed through the enclosure. The component (104) positioned within the aperture may include a transparent material. The method may also include welding the component (104) to the electronic device enclosure.