Transparent Conductive Layer Layout for Slim-Bezel Displays
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Solution Overview
Problem
Existing display devices face challenges in achieving slim borders due to the metal pad for voltage signal output occupying wiring and border width, which is not compatible with current design requirements.
Innovation Solution
The conductive substance is positioned on the transparent conductive layer of the protection assembly, overlapping the peripheral area of the driving substrate, allowing it to be outside the sealed area, thus reducing the border design and enabling slim borders.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the metal pad is disposed in the sealed area to provide voltage signal output, then electrical connection is achieved, but the border width increases and cannot meet slim border design requirements
Solution Approach 1:
The patent moves the conductive substance from the sealed area (2D plane within the display structure) to the peripheral area outside the sealed area, effectively changing the spatial dimension of the electrical connection path. This allows the metal pad to be positioned in the peripheral area where it does not occupy border width, thus achieving slim borders while maintaining electrical connectivity through the transparent conductive layer and conductive substance in the new spatial location.
Solution Approach 2:
The patent extracts the conductive substance from the sealed area and relocates it to the peripheral area. By separating the electrical connection function from the sealed area, the design eliminates the conflict between electrical connection requirements and border width constraints, allowing the sealed area to be minimized for slim border design while the peripheral area handles the electrical connection functions.
2Length of stationary object
If the metal pad occupies the wiring of the front plane laminate, then electrical connection is established, but the border width increases
Solution Approach 1:
The patent relocates the wiring path from the front plane laminate within the sealed area to the peripheral area outside the sealed area. This spatial reconfiguration allows the wiring to be routed through the peripheral area where it does not constrain the border width, enabling both slim borders and maintained wiring functionality for ease of manufacture.
Solution Approach 2:
The patent extracts the wiring function from the sealed area and places it in the peripheral area. This separation allows the sealed area to be optimized for minimal border width while the peripheral area accommodates the wiring layout, resolving the conflict between border slimness and manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the border width by utilizing the space originally reserved for the conductive substance, meeting the design requirements for slim borders.
Implementation Method 1
The transparent conductive layer is electrically connected with the driving substrate through the conductive substance
Implementation Method 2
The sealant layer is disposed in the sealed area of the driving substrate to at least cover a periphery of the display medium layer
Implementation Method 3
the protection assembly further includes a water vapor barrier layer disposed between the cover plate and the transparent conductive layer
Data Source
AI summary
A display device includes a driving substrate, a display medium layer, a protection assembly, a sealant layer, a driving chip, and a conductive substance. The driving substrate has a display area, a sealed area, and a peripheral area. The display medium layer is disposed in the display area of the driving substrate. The protection assembly is located on the display medium layer and includes a cover plate and a transparent conductive layer disposed on the cover plate. The sealant layer is disposed in the sealed area of the driving substrate to as least cover a periphery of the display medium layer. The driving chip is disposed in the peripheral area of the driving substrate. The conductive substance is disposed on the transparent conductive layer of the protection assembly. An orthographic projection of the conductive substance on the driving substrate overlaps the peripheral area of the driving substrate, and the transparent conductive layer is electrically connected with the driving substrate through the conductive substance.