Transparent LED Display Lens Structure for Uniform Color Mixing
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Solution Overview
Problem
Existing transparent LED displays suffer from issues such as color mixing deviations, low transmittance, and non-uniform luminance, leading to poor color uniformity and viewing angles.
Innovation Solution
A transparent display device incorporating a transparent base with light sources, a planarization layer, a cover layer, and a lens structure featuring a micro lens array or unit lens, along with an encapsulation layer that may include a light scattering agent, to improve color uniformity and viewing angles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If red, green, and blue LEDs are used as light sources in a transparent display device, then the display can achieve full-color capability, but color mixing is not well performed resulting in left and right color deviations at specific viewing angles
Solution Approach 1:
A transparent resin layer is introduced as an intermediary medium between the red, green, and blue LEDs and the viewer. This resin layer performs optical mixing of the three colors through its material properties, creating a uniform white light appearance from the viewer's perspective while eliminating the color separation and viewing angle limitations of direct LED emission.
2Reliability
If a transparent resin layer is used for encapsulation, then the light sources are protected and encapsulated, but transmittance is not high at visible light wavelengths causing decrease in luminance
Solution Approach 1:
The optical parameters of the encapsulation material are optimized by selecting a transparent resin with specific refractive index and transmittance characteristics. The resin is engineered to have high transmittance in the visible light range while maintaining adequate protection, balancing the conflicting requirements of enclosure and light transmission.
3Ease of manufacture
If package-type LEDs are used with both electrodes and wiring patterns formed on the transparent film base surface, then the light sources can be properly electrically connected and controlled, but the size of the light source and control IC determines the transmittance of the transparent film
Solution Approach 1:
The electrical connections and control IC are positioned in the plane dimension on the base surface, while the light emission occurs in the vertical dimension through the transparent resin layer. This spatial separation allows the wiring and control elements to occupy minimal area on the transparent surface, maximizing light transmission while maintaining functional electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances color reproducibility, achieves a uniform viewing angle, and adjusts the overall thickness, providing improved light emission characteristics and expanded use environments.
Implementation Method 1
an encapsulation layer that may include a light scattering agent
Implementation Method 2
a lens structure featuring a micro lens array or unit lens
Implementation Method 3
light emitting diodes (LEDs) are semiconductor light emitting elements well known as converting current into light
Data Source
AI summary
The present disclosure relates to a transparent display device, which is applicable to a technical field related to display devices and uses, for example, a light-emitting diode (LED). The present disclosure comprises: a transparent base material; a plurality of light sources provided on the transparent base material so as to form individual pixels; a planarization layer for covering the light sources; and a cover layer located on the planarization layer, wherein the light sources can individually comprise: a wiring substrate; a light-emitting unit comprising a first LED, a second LED, and a third LED located on the wiring substrate so as to form sub-pixels; a driving chip for driving the light-emitting unit; an encapsulation layer located on the wiring substrate so as to cover the light-emitting unit and the driving chip; and a lens structure located on the encapsulation layer.