Transparent LED Package With Integrated Driver for High-Resolution Pixels
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Solution Overview
Problem
Conventional light emitting device packages require multiple components to form one pixel, leading to increased mounting area, complex wiring, limited display enlargement, reduced transparency, and heat resistance issues due to separate driving devices.
Innovation Solution
A transparent light emitting package with a substrate featuring a first and second wiring layer, a light emitting device, a driving device, and a penetrating electrode for electrical connection, allowing for ultra-thin construction, simplified manufacturing, and individual LED control, with a substrate formed by laminating copper foil-formed films to reduce costs and prevent heat concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional light emitting device packages are used with separate driving devices, then each pixel can be controlled, but the mounting area increases and resolution cannot be increased
Solution Approach 1:
The patent combines the light emitting device and driving device into a single integrated package structure. The driving device is mounted on the same substrate as the light emitting device, with wiring layers connecting them directly. This merging eliminates the need for separate driving devices for each pixel, reducing the overall mounting area while maintaining full control functionality, thereby enabling higher resolution displays.
Solution Approach 2:
The patent utilizes multi-layer substrate structures with wiring layers formed on both upper and lower surfaces. By transitioning from a single-plane layout to a three-dimensional multi-layer configuration, the patent achieves compact integration of driving and light emitting devices without increasing the planar mounting area, thus resolving the contradiction between control functionality and area consumption.
2Ease of operation
If separate driving devices are mounted on the border, then pixel control is achieved, but wiring becomes complicated
Solution Approach 1:
The driving device is integrated onto the same substrate as the light emitting device rather than being mounted separately on the border. This integration allows wiring to be formed directly on the substrate using standard semiconductor fabrication processes, significantly simplifying the wiring structure while maintaining the ability to control each pixel independently through the integrated driving circuit.
Solution Approach 2:
The patent replaces complex external wiring connections with integrated circuit wiring formed through semiconductor fabrication processes. Instead of using separate mechanical wiring connections between border-mounted driving devices and light emitting devices, the patent uses lithographically defined conductive patterns on the substrate, dramatically reducing wiring complexity.
3Productivity
If driving devices such as large driver IC are installed, then multiple packages can be controlled, but display enlargement is limited due to bezel space requirements
Solution Approach 1:
The patent integrates the driving device functionality directly into each pixel package, eliminating the need for separate large driver ICs mounted on the bezel. This integration removes the bezel space constraint, allowing the display to be enlarged to the full substrate area without reserved borders for external driving devices.
Solution Approach 2:
The patent divides the driving functionality into distributed driving devices, with each pixel or pixel group having its own integrated driving circuit on the substrate. This segmentation eliminates the need for centralized large driver ICs on the bezel, freeing up all border space for display enlargement while maintaining independent control of each pixel segment.
4Illumination intensity
If multiple packages are used to form one pixel, then color display is achieved, but transparency and heat resistance are reduced
Solution Approach 1:
The patent combines red, green, and blue light emitting devices along with their driving circuits into a single integrated pixel package on one substrate. This unified structure improves transparency by eliminating multiple separate package interfaces and enhances heat resistance by consolidating all components into a single thermally managed structure, while maintaining full color display capability through the integrated RGB devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in an ultra-thin, cost-effective, and highly expressive transparent light emitting package with improved transparency and heat resistance by integrating R, G, and B LED chips and a driver IC within a single package, simplifying manufacturing and reducing the complexity of driving circuits.
Implementation Method 1
a penetrating electrode penetrating at least a portion of the substrate such that the first wiring layer and the second wiring layer are electrically connected
Implementation Method 2
the first substrate layer and the second substrate layer are thermocompressed with a laminating member disposed between them to form a substrate
Data Source
AI summary
The present disclosure relates to a transparent light emitting package and manufacturing method thereof in which a light emitting device and a driving device can be packaged to form one pixel, and may include a substrate; a first wiring layer formed on a first surface of the substrate; at least one light emitting device mounted on a portion of the first wiring layer; at least one driving device mounted on other portion of the first wiring layer driving the light emitting device; a second wiring layer formed on a second surface of the substrate; and a penetrating electrode penetrating at least a portion of the substrate such that the first wiring layer and the second wiring layer are electrically connected.