Transparent LED Chip Layout for Thin Single-Side Mounting
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Solution Overview
Problem
Existing light-emitting components are not designed for compact and cost-effective mounting of small semiconductor chips, lacking a solution for efficient electrical connection and mechanical stability while maintaining a thin and flexible design.
Innovation Solution
A light-emitting component featuring a transparent conductive layer covering a semiconductor chip, with electrical connection points on one side and a transparent carrier for mechanical support, allowing surface-mounting without a submount, and incorporating a chip encapsulation body for protection and increased contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a submount is used for mounting the semiconductor chip, then mechanical stability is improved, but device thickness and complexity increase
Solution Approach 1:
The patent merges the mounting function directly into the transparent conductive layer by forming electrical connection points that serve both as electrical contacts and mechanical mounting points. The semiconductor chip is mounted directly onto the transparent conductive layer without requiring a separate submount, thereby eliminating an additional component while maintaining mechanical stability through the integrated connection structure.
2Ease of manufacture
If the transparent conductive layer completely covers the semiconductor chip, then manufacturing ease is improved, but material cost increases
Solution Approach 1:
The patent applies local quality by structuring the transparent conductive layer to provide different coverage areas: a first area that completely covers the semiconductor chip for optimal electrical contact and protection, and a second area that extends beyond the chip edges to provide additional mounting surface and mechanical support. This selective extension of the conductive layer material optimizes both manufacturing ease and material utilization.
3Reliability
If electrical connection points are arranged on both sides of the semiconductor chip, then electrical connectivity is improved, but device thickness increases
Solution Approach 1:
The patent transitions from a three-dimensional arrangement where connection points would be distributed on both sides of the chip to a two-dimensional arrangement where all electrical connection points are positioned on a single side of the transparent conductive layer. This dimensional reorganization allows multiple electrical contacts to be accessed from one side, eliminating the need for back-side connections and reducing overall device thickness while maintaining reliable electrical connectivity through the transparent conductive layer's conductive pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables compact, thin, and flexible mounting of small semiconductor chips with reduced material costs and enhanced mechanical stability, facilitating efficient light emission and electrical connectivity.
Implementation Method 1
Transparent means here and in the following that a transparent element of the component is transparent to the electromagnetic radiation generated by the light-emitting semiconductor chip
Implementation Method 2
The light-emitting semiconductor chip is designed to emit colored light, for example red, green, or blue light, during operation
Implementation Method 3
Luminescent diode chip may be a light-emitting diode chip or a laser diode chip
Data Source
AI summary
The invention relates to a light-emitting component comprising a light-emitting semiconductor chip, a transparent conductive layer, and at least two electrical connection points, wherein the transparent conductive layer covers the light-emitting semiconductor chip at least in places, and the electrical connection points are arranged on a side of the light-emitting semiconductor chip facing away from the transparent conductive layer.