Transparent LED Unit Layout for Bright High-Density Subpixels
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Solution Overview
Problem
Conventional LEDs require a large number of chips to form a display apparatus, leading to excessive time consumption in the mounting process and occupying a significant area, which can result in brightness deterioration when subpixels are reduced in size.
Innovation Solution
The use of micro LEDs with a unique structure where LED stacks are stacked one above another, connected to two electrode pads for independent driving, and utilizing growth substrates like GaAs to simplify manufacturing and reduce the likelihood of ohmic electrode peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional LEDs are arranged in a two-dimensional plane with one LED chip per subpixel, then the display can generate various colors, but the number of LED chips required exceeds millions, causing excessive time consumption for mounting
Solution Approach 1:
The patent transitions from a two-dimensional arrangement of LED chips to a three-dimensional stacked structure. Multiple LED stacks are arranged vertically, with each stack containing multiple LED chips at different heights. This vertical stacking enables millions of subpixels to be mounted in a much smaller physical footprint, dramatically reducing mounting time while maintaining full color generation capability through the combination of blue, green, and red LED chips in each stack.
Solution Approach 2:
The display is segmented into multiple independent LED stacks arranged in a grid pattern. Each LED stack is a self-contained unit containing blue, green, and red LED chips that can be manufactured and tested separately before final assembly. This segmentation allows for parallel processing during manufacturing and simplifies the mounting process, as entire stacks rather than individual chips are handled and positioned.
2Quantity of substance
If the area of each subpixel is reduced to fit more pixels in a restricted area, then the pixel density increases, but brightness deteriorates due to reduced luminous area
Solution Approach 1:
The patent utilizes the third dimension (vertical stacking) to increase the effective luminous area within a confined two-dimensional footprint. By stacking multiple LED chips vertically at different heights, each subpixel can maintain a sufficient luminous area for bright light emission while the overall pixel density increases because multiple subpixels share the same horizontal footprint through vertical arrangement.
Solution Approach 2:
The LED chips are nested vertically within each other in a stacked configuration. Multiple LED chips are positioned at different heights along the vertical axis, with each chip contributing to the luminous output of the same subpixel location. This nesting allows the effective luminous area to be summed across multiple vertical layers, maintaining brightness while reducing the horizontal area required per subpixel.
3Illumination intensity
If LED stacks are stacked one above another to increase subpixel area without increasing pixel area, then brightness is improved, but the structural stability and electrical connection reliability may deteriorate
Solution Approach 1:
The patent introduces intermediate substrate layers and bonding structures between stacked LED chips to ensure structural stability and reliable electrical connections. Each LED chip is bonded to the substrate or previous chip through intermediate bonding layers that provide mechanical support and thermal management. Through-hole vias and conductive structures serve as intermediaries to establish electrical pathways between chips at different heights, ensuring signal integrity and power delivery throughout the vertical stack.
Solution Approach 2:
The patent employs composite material structures combining different materials with complementary properties. The substrate and bonding layers use materials with appropriate thermal expansion coefficients, conductivity, and adhesion properties to ensure reliable bonding between LED chips. The combination of conductive materials for electrical connections, insulating materials for isolation, and structurally robust materials for mechanical support creates a composite structure that maintains reliability under thermal and mechanical stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the area of each subpixel without increasing the pixel area, reduces manufacturing time, and provides a structurally stable display with improved brightness and efficiency.
Implementation Method 1
a first light emitting diode (LED) sub-unit, a second LED sub-unit disposed below the first LED sub-unit, a third LED sub-unit disposed below the second LED sub-unit
Data Source
AI summary
A light emitting device for a display including a transparent member laterally extending in a first direction and having a first region and a second region surrounding the first region, first to third light emission regions disposed on the transparent member, a support substrate, first to fourth electrode pads disposed between the transparent member and the support substrate, and vias electrically connecting the electrode pads to the light emission regions, respectively, in which the fourth electrode pad is electrically connected to at least one of the vias, each light emission region is disposed in the first region and does not overlap the second region in a second direction, and the fourth electrode pad overlaps one of the vias and one of the light emission regions in the second direction, and the one of the vias and the one of the light emission regions are separated from each other.