Transparent LED Substrate Layout for Uniform Two-Sided Lighting

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Solution Overview

Problem

Traditional LED lamps have low lighting efficiency and high costs due to the use of planar, opaque substrates that limit the flexibility and effectiveness of LED chips, leading to increased energy consumption and higher costs.

Innovation Solution

A light emitting device with a transparent substrate that allows light to pass through, featuring LED chips with a wider than 180° light emitting angle, enabling light to penetrate and emerge from both sides of the substrate, and adjustable substrate arrangements for enhanced flexibility and uniform lighting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If planar opaque substrates are used to deposit LED chips, then the structural stability is improved, but the lighting efficiency deteriorates due to light absorption and limited light propagation directions

Engineering Contradiction:
Improvestructural stabilityVSAvoidlighting efficiency
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The substrate material parameter is changed from opaque to transparent, fundamentally altering the light propagation characteristics. This allows light to pass through the substrate rather than being absorbed, directly resolving the contradiction between structural stability and lighting efficiency by maintaining substrate integrity while enabling omnidirectional light transmission

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention transitions from planar 2D light emission to 3D omnidirectional light propagation by using transparent substrates. Light can now travel in multiple dimensions (through the substrate, around edges, and in various angles), eliminating the limitation of single-direction light propagation and significantly improving lighting efficiency

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Illumination intensity

If multiple LED chips are deposited on planar substrates with reflection mechanisms, then the brightness requirement is met, but the device complexity and cost increase

Engineering Contradiction:
ImprovebrightnessVSAvoidnumber of LED chips and reflection mechanisms
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

By changing the substrate transparency parameter, the system achieves omnidirectional light emission from each LED chip. This eliminates the need for complex reflection mechanisms and multiple chips, as each chip can now effectively illuminate in all directions, reducing both device complexity and cost while maintaining brightness

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention extracts and removes the unnecessary reflection mechanisms from the system. By using transparent substrates, the light propagation function is achieved directly through the substrate material rather than requiring additional reflection components, simplifying the overall device structure

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of manufacture

If planar firm opaque substrates are used, then the manufacturing process is simplified, but the flexibility of disposing LED chips deteriorates

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidflexibility of disposing LED chips
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The substrate transparency parameter is changed to enable flexible LED chip disposal arrangements. Transparent substrates allow light to pass through, enabling LED chips to be positioned in various configurations (including non-planar arrangements) without compromising light transmission or creating shielding effects, thus improving adaptability while maintaining manufacturing simplicity

Inventive Principle:
Principle #35Parameter changes

4Reliability

If traditional LED lamps use opaque substrates, then the structural integrity is maintained, but the power consumption increases due to low lighting efficiency

Engineering Contradiction:
Improvestructural integrityVSAvoidpower consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

By changing the substrate from opaque to transparent, the system achieves omnidirectional light emission that significantly improves lighting efficiency. This reduces power consumption because each LED chip's light is effectively utilized in all directions rather than being absorbed or requiring multiple chips for compensation, while the substrate maintains its structural integrity

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides high reliability, improved lighting efficiency, and reduced costs by allowing for flexible substrate arrangements and consistent lighting performance, while maintaining sufficient brightness and uniformity across various applications.

Implementation Method 1

at least one LED chip comprising multiple light emitting surfaces and emitting light omni-directionally

Methodology Applied
Scientific EffectLight Emitting Diode: Light Emitting Diode

Implementation Method 2

a transparent substrate which light can pass through... the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from a second main surface

Methodology Applied
Scientific EffectLight transmission through transparent substrate: Refraction

Data Source

PatentUS11808436B2Light emitting apparatus
Publication Date: 2023.11.07 EDISONLED LLC
  • US11808436B2 patent drawing
  • US11808436B2 patent drawing
  • US11808436B2 patent drawing

AI summary

A light emitting apparatus, including: a first light emitting device with a first substrate having a first upper surface and first bottom surface, a plurality of first LED chips disposed on the first upper surface, emitting a light penetrating the first substrate, and a first wavelength conversion layer directly contacting the plurality of first LED chips and first upper surface, and a first shape in a cross-sectional view; a second wavelength conversion layer directly contacting the first bottom surface; a second shape in the cross-sectional view substantially the same as the first shape; a second light emitting device separated from the first light emitting device, including a second substrate and plurality of second LEDs disposed on the second substrate; a support base connected to the first light emitting device by a first angle and connected to the second light emitting device by a second angle; and a first support arranged between the support base and first light emitting device.