Transparent Moulded Photosensitive Assembly for Cleaner Camera Modules
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Solution Overview
Problem
Conventional camera module manufacturing methods face challenges in protecting the photosensitive region of chips, leading to defects, contamination, and reduced reliability, especially with opaque molding materials, which require complex processes and additional components for light window adjustments.
Innovation Solution
A camera module design using a transparent molding portion with integrated light shielding and filtering layers, allowing for adjustable light entrance windows and direct attachment of filter elements, eliminating the need for die sinking and additional components, and enhancing environmental robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metal casing is used for the camera module, then structural strength and protection are improved, but heat dissipation performance deteriorates due to poor thermal conductivity to the external environment
Solution Approach 1:
The camera module is divided into two distinct parts: a metal upper housing that provides structural strength and protection, and a plastic lower housing that serves as a heat dissipation component. This segmentation allows each part to fulfill its specific function optimally without compromise.
Solution Approach 2:
The metal support plate acts as an intermediary component between the image sensor module and the plastic housing. It transfers heat from the image sensor through the plastic housing to the external environment, enabling effective heat dissipation while maintaining the metal upper housing for structural integrity.
2Ease of manufacture
If multiple components are assembled using traditional methods, then manufacturing flexibility is maintained, but manufacturing precision and efficiency deteriorate due to multiple assembly steps and alignment requirements
Solution Approach 1:
The metal support plate is integrated directly into the injection molding process of the plastic housing, combining what would traditionally be separate assembly steps into a single manufacturing operation. This eliminates the need for separate mounting operations and ensures precise positioning.
Solution Approach 2:
The mounting holes and attachment features for the metal support plate are pre-formed during the injection molding process of the plastic housing. This preliminary action ensures precise alignment and positioning before the actual assembly of the image sensor module, improving both precision and efficiency.
3Device complexity
If the image sensor is fixed directly to the casing, then device complexity is reduced, but manufacturing precision deteriorates due to difficulty in controlling positioning accuracy
Solution Approach 1:
The metal support plate serves as an intermediary component between the image sensor module and the plastic housing. It provides precise positioning features and mounting holes that ensure accurate alignment of the image sensor, while the entire assembly is integrated into the molded housing to maintain reasonable device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves reliability, reduces production complexity and costs, and enhances optical performance by allowing for adjustable light characteristics and easier cleaning, while maintaining high yield and efficiency.
Implementation Method 1
The injection moulded photosensitive component comprises a photosensitive component and an injection moulded component, wherein the injection moulded component is formed by injecting a photoresist material into a mould cavity
Data Source
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AI summary
Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production. (Fig. 1)