Transparent Resin Semiconductor Packaging With Warpage-Constraining Walls
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Solution Overview
Problem
Conventional semiconductor packages with transparent resins face issues such as warpage, thermomechanical defects, and cosmetic problems due to high coefficients of thermal expansion and low Young's modulus, leading to yield loss and appearance defects, especially when using epoxy-based or silicone-based resins.
Innovation Solution
The semiconductor packages incorporate a panel substrate with protruding walls to constrain the transparent resin, minimizing warpage and using either epoxy-based or silicone-based transparent resin based on application needs, with a method that allows for universal mold tools to reduce tool costs and prevent cosmetic issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If epoxy-based transparent resin is used, then transparency and radiation detection capability are improved, but warpage and thermomechanical defects occur due to high CTE
Solution Approach 1:
The patent changes the material parameter by switching from epoxy-based resin to silicone-based resin, which has a lower coefficient of thermal expansion. This parameter change resolves the contradiction by maintaining transparency while reducing thermomechanical stress and warpage issues.
Solution Approach 2:
The patent uses composite material design by combining silicone-based resin with specific additives and formulations to achieve both optical transparency and thermal stability, creating a material that balances both requirements.
2Reliability
If silicone-based transparent resin is used, then thermomechanical stability is improved, but cosmetic problems and appearance defects occur
Solution Approach 1:
The patent optimizes the silicone-based resin formulation by adjusting crosslinking density, molecular weight, and additive composition to eliminate cosmetic defects while preserving the thermomechanical stability benefits of silicone resin.
Solution Approach 2:
The patent applies different regional qualities within the resin system, using specific silicone resin formulations in critical cosmetic areas while maintaining overall thermomechanical stability throughout the package.
3Illumination intensity
If transparent resin with high CTE is used, then radiation transmission is improved, but yield loss increases due to thermomechanical defects
Solution Approach 1:
The patent changes the resin material from epoxy to silicone-based, fundamentally altering the CTE parameter to be closer to the semiconductor die. This reduces warpage and thermomechanical defects during manufacturing, thereby improving yield while maintaining radiation transmission capability.
4Ease of manufacture
If conventional transparent resin is used, then manufacturing simplicity is maintained, but tool costs increase due to cosmetic rework requirements
Solution Approach 1:
The patent modifies the resin material parameters to eliminate cosmetic defects, which removes the need for expensive rework tools and equipment while maintaining simple manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces yield loss and cosmetic defects, enhances robustness, and allows for flexible resin selection based on environmental demands, improving the manufacturing efficiency and reliability of semiconductor packages.
Implementation Method 1
A transparent resin is present between the plurality of wall portions and the transparent resin covers the one or more dice and the at least one wirebond such that the one or more dice and the at least one wirebond is encased within the transparent resin
Implementation Method 2
The plurality of walls constrain and limit expansion of the transparent resin
Implementation Method 3
conventional semiconductor packages that include sensors whose operation is to detect radiation (e.g., UV sensors, time-of-flight (TOF) sensors, etc.) are assembled such that the radiation sensors are in a transparent medium
Data Source
AI summary
A method of manufacturing a semiconductor package with an one or more dice present within a transparent resin, which may be an epoxy-based transparent resin or a silicone-based transparent resin, includes coupling the one or more dice to respective surfaces of a plurality of base portions of a panel substrate. Each one of the respective surfaces is between ones of a plurality of walls of the panel substrate that protrude from the respective surfaces of the panel substrate. A plurality of wirebonds may be formed to provide electrical pathways between the one or more dice and conductive structures of the panel substrate accessible at the respective surfaces of the panel substrate. A transparent resin may be formed to fill recesses or cavities between ones of the plurality of walls, and the panel substrate may then be singulated along the plurality of walls.