Transparent Pillar Light Collimator for Semiconductor Pixel Protection
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Solution Overview
Problem
Existing light collimators and methods for forming semiconductor devices are not satisfactory in terms of protecting pixels and optimizing collimation performance, leading to potential damage and energy loss due to light divergence.
Innovation Solution
A semiconductor device with a light collimator layer featuring transparent pillars and a connection feature made of a transparent material, where the pillars cover the pixels and connect to a transparent connection feature, enhancing collimation performance by increasing the height-to-width ratio and preventing damage or contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the height-to-width ratio of transparent pillars is increased to improve collimation performance, then collimation performance is improved, but the pillars become more susceptible to damage and contamination
Solution Approach 1:
The light collimator layer is segmented into multiple components: transparent pillars, transparent connection features, and light-shielding features. The transparent connection feature acts as a base structure that supports the transparent pillars, dividing the functional elements into distinct structural units that can be formed and protected independently.
Solution Approach 2:
The transparent connection feature is formed beforehand to provide a protective base structure before the transparent pillars are completed. This preliminary structural support prevents damage and contamination during subsequent manufacturing processes while allowing the pillars to achieve the necessary height-to-width ratio for optimal collimation.
2Ease of manufacture
If existing light collimator structures are used, then manufacturing is simpler, but pixels are not adequately protected and energy loss due to light divergence occurs
Solution Approach 1:
The invention extends the collimator structure into the vertical dimension by forming transparent pillars with controlled height-to-width ratios. This three-dimensional structure provides both protective coverage over the pixels and effective light collimation, simultaneously addressing protection needs and energy loss prevention without complicating the manufacturing process.
Solution Approach 2:
The light collimator layer uses composite structural elements combining transparent materials (for the pillars and connection features that interact with light) and light-shielding materials (for protective features). This composite approach enables simultaneous achievement of light collimation, pixel protection, and manufacturing feasibility.
3Illumination intensity
If transparent pillars are made taller to enhance collimation, then collimation performance is improved, but the risk of damage and contamination during processing increases
Solution Approach 1:
The transparent connection feature serves as a cushioning base structure formed beforehand to support the transparent pillars during manufacturing. This base structure absorbs mechanical stresses and prevents damage to the taller pillars, while the light-shielding features provide additional protection against contamination, allowing the pillars to maintain their height for effective collimation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects pixels and improves collimation performance by allowing a higher height-to-width ratio for the transparent pillars, reducing energy loss and enhancing the overall performance of the light collimator layer.
Implementation Method 1
The light collimator performs the function of collimating light to reduce energy loss due to light divergence
Data Source
AI summary
A semiconductor device is provided. The semiconductor device includes a substrate. The substrate includes a plurality of pixels. The semiconductor device also includes a light collimator layer disposed on the substrate. The light collimator layer includes a transparent connection feature disposed on the substrate, and a plurality of transparent pillars disposed on the transparent connection feature. The plurality of transparent pillars cover the plurality of pixels, and the transparent connection feature connects to the plurality of transparent pillars. The plurality of transparent pillars and the transparent connection feature are made of a first material which includes a transparent material. The light collimator layer also includes a plurality of first light-shielding features disposed on the transparent connection feature. The top surface of one of the transparent pillars is level with the top surface of one of the first light-shielding features.