Transparent Pixel Electrode Layout for Micro-LED Mounting Heat Control
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Solution Overview
Problem
The mounting of micro-LEDs on substrates using solder material can generate thermal stress, potentially damaging other elements in micro-LED displays due to the heat generated during the melting process, which affects the characteristics and reliability of the display.
Innovation Solution
The use of a transparent conductive material for the anode electrode, which has low thermal conductivity, reduces the propagation and diffusion of heat from the solder material, minimizing thermal stress and maintaining the integrity of the display components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solder material is melted using laser or other heating methods to mount micro-LEDs on substrate, then mounting is achieved, but thermal stress damages other elements and changes their characteristics
Solution Approach 1:
A heat-resistant organic insulating layer is introduced as an intermediary between the solder material and the thin-film transistor elements. This layer has a glass transition temperature of 150°C or higher, allowing it to withstand the melting temperature of the solder material without deforming, thereby blocking thermal stress from reaching and damaging the TFT elements during the mounting process
Solution Approach 2:
The glass transition temperature of the organic insulating layer is specifically changed to 150°C or higher through material selection or modification. This parameter change enables the insulating layer to maintain its structural integrity at solder melting temperatures, creating a thermal barrier that protects underlying elements while still allowing the mounting process to proceed
2Ease of manufacture
If conventional organic insulating layers are used, then manufacturing is simplified, but they deform at solder melting temperature causing delamination and cracking
Solution Approach 1:
The glass transition temperature of the organic insulating layer is elevated to 150°C or higher, transforming it from a heat-sensitive material to a heat-resistant one. This parameter change allows the layer to maintain its mechanical strength and adhesion during solder reflow processes, preventing delamination and cracking while preserving the simplicity of the layered structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the resistance to thermal stress during the mounting process, preventing delamination and cracking of conductive layers and maintaining the characteristics of the thin-film transistors, thus improving the reliability and performance of micro-LED displays.
Implementation Method 1
The use of a transparent conductive material for the anode electrode, which has low thermal conductivity, reduces the propagation and diffusion of heat from the solder material
Data Source
AI summary
According to one embodiment, a display device includes a display panel including a display area for displaying an image, and the display panel includes an insulating substrate, a first electrode, a first organic insulating layer, an inorganic insulating layer, a pixel electrode, a second organic insulating layer, and a pad portion. The inorganic insulating layer includes a first opening for electrically connecting the first electrode to the pixel electrode. The second organic insulating layer includes a second opening for electrically connecting the pixel electrode to the pad portion. The pixel electrode is formed of a transparent conductive material.