Transparent Plate Photosensitive Module for Heat and Sensor Stability
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Solution Overview
Problem
Conventional photosensitive modules face issues with image quality due to device shaking and heat generation, leading to potential damage and reduced functionality.
Innovation Solution
A photosensitive module design incorporating a base assembly with a metal substrate, a transparent plate, an image sensor, and thermal and insulating layers, along with plastic members for protection and heat dissipation, and a vibration assembly for dust removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the image sensor operates at high pixel density, then image quality is improved, but heat generation increases causing module damage
Solution Approach 1:
A transparent plate is introduced as an intermediary component between the lens and image sensor. This plate serves multiple functions: it provides a stable mounting structure, enables effective thermal coupling pathways, and maintains precise optical alignment. The plate's material properties facilitate heat dissipation while preserving image quality at high pixel densities.
Solution Approach 2:
The patent changes the material parameters and thermal properties of the mounting structure. By selecting specific materials for the transparent plate and optimizing thermal interface parameters, the system achieves improved heat dissipation capability while maintaining the high pixel density required for image quality.
2Volume of moving object
If the device is miniaturized, then device size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent utilizes the transparent plate to create additional thermal management dimensions. The plate's structure enables heat dissipation pathways in multiple directions, allowing effective thermal management in a miniaturized form factor by distributing heat across different spatial dimensions rather than relying solely on planar dissipation.
3Stability of the object's composition
If the lens module is made shockproof, then stability is improved, but device complexity increases
Solution Approach 1:
The transparent plate performs multiple functions simultaneously: it provides mechanical shock resistance, enables thermal management, maintains optical alignment, and serves as a mounting structure. This multi-functionality reduces overall module complexity while achieving shockproof performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency, reduces image sensor skew, enhances module stability, and miniaturizes the device while maintaining image quality by effectively managing heat and vibrations.
Implementation Method 1
a thermal adhesive disposed between the substrate and the image sensor, wherein the thermal adhesive is in contact with the main body of the substrate and the image sensor
Implementation Method 2
When the photosensitive module receives light, the light passes through the first transparent plate and an opening of the main body sequentially to the image sensor
Data Source
AI summary
A photosensitive module is provided, for receiving light passing through a lens in an electronic device, including a base assembly, a first plastic member, a first lead assembly, an image sensor, and an opening. The base assembly includes a substrate, an insulating layer, and a circuit layer. The substrate has a main body that includes a metal material. The first plastic member is connected to the base assembly. The first plastic member encapsulates at least part of the lead assembly. The image sensor is for receiving a light and is electrically connected to the circuit layer via the lead assembly. The opening is formed at the main body, and corresponds to the image sensor. When observed along a direction in which the light travels, the opening overlaps the image sensor.