Diffusion-Bonded Transparent Plates With Laser-Patterned Isolation
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Solution Overview
Problem
Conventional methods for producing electrostatic holding devices and conductor components are complex, limited by material restrictions, and involve high temperatures and pressures, which restrict the use of materials with different thermal and electrical properties and result in limited precision and abrasion resistance.
Innovation Solution
A method involving atomic diffusion bonding of two optically transparent, electrically isolating plates with a metal layer embedded between them, where the metal layer is processed using laser radiation to form conductor and isolator sections, allowing for the use of diverse materials and high-voltage-resistant electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional deposition and bonding methods are used to produce electrostatic holding devices, then the production process is established, but the process complexity increases and material selection is restricted
Solution Approach 1:
The invention merges the bonding layer and metal layer into a single integrated structure. The metal layer is deposited directly on the bonding interface between two substrates, eliminating the need for separate bonding and metal deposition processes. This combination simplifies the overall manufacturing process while maintaining functional requirements for both bonding and electrical conductivity.
Solution Approach 2:
The bonding layer serves multiple functions simultaneously: it provides mechanical bonding between substrates, acts as a metal layer for electrical conductivity in electrostatic holding devices, and can be structured to form electrodes. This multi-functionality reduces the number of separate layers and processes needed, thereby simplifying manufacturing.
2Strength
If high temperature and pressure diffusion bonding is used, then strong bonding is achieved, but material selection is limited due to thermal expansion constraints
Solution Approach 1:
The invention changes the bonding parameters from high temperature and pressure to room temperature and atmospheric pressure conditions. Atomic diffusion bonding occurs spontaneously at room temperature when clean, flat surfaces are brought into contact, eliminating thermal expansion constraints and enabling bonding of materials with different thermal properties such as glass and sapphire.
Solution Approach 2:
The invention replaces the thermal-mechanical bonding system (high temperature and pressure diffusion bonding) with a chemical-physical system based on atomic diffusion at room temperature. This substitution eliminates the need for thermal expansion matching and allows greater material versatility while maintaining strong bonding.
3Reliability
If metal layers are deposited on substrate surfaces and then covered with protective layers, then metal layers are protected from environmental influences, but additional process costs and complexity are incurred
Solution Approach 1:
The metal layer is deposited on the bonding interface before the second substrate is attached. This preliminary placement allows the metal layer to be immediately protected by the second substrate, eliminating the need for separate protective coating processes. The substrate itself serves as the protective layer.
4Strength
If anodic bonding is used to join glass plates, then bonding is achieved, but material selection is restricted to specific glass types with suitable properties
Solution Approach 1:
The invention changes the bonding conditions from the specific electrochemical conditions required for anodic bonding (aqueous environment, voltage application, specific glass compositions) to neutral atomic diffusion conditions at room temperature in air or vacuum. This allows bonding of any materials with clean, flat surfaces including glass, sapphire, diamond, and ceramics without material-specific constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the production process, enables the use of materials with different properties, and produces components with high mechanical resistance and precision, overcoming the limitations of conventional techniques.
Implementation Method 1
The plates are joined by bonding, in particular by atomic diffusion bonding
Implementation Method 2
The metal layer is processed by locally limited heating of the metal layer by means of laser radiation
Data Source
AI summary
A method for producing a component from two plates, which are electrically isolating, at least one is optically transparent, and between them at least one planar conductor section and at least one isolator section are formed, comprises bonding the plates at mutually facing bonding faces, wherein a metal layer is arranged therebetween, and processing the metal layer by local heating using laser radiation such that the metal layer is converted into the at least one isolator section in a part region, and the at least one conductor section is formed adjacent thereto. To form the at least one isolator section, the light path of the laser radiation and the component are moved relative to each other to convert the metal layer into the at least one isolator section over a line or area. Bonding faces of metallic bond layers are polished. The plates are bonded by atomic diffusion bonding.