Transparent SMD Holder Sidewalls for LED Light Transmittance
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Solution Overview
Problem
The existing SMD holders have low light transmittance due to their nontransparent sidewalls, which obstruct the emission of light from the chip when powered on.
Innovation Solution
A hollow SMD holder with transparent plastic sidewalls, featuring a specific area ratio for the function, insulation, and second function areas, and a through hole for improved light transmission, along with a transparent insulation area and base coating for enhanced light emission and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If nontransparent material is used for sidewalls of the SMD holder, then structural integrity and electrical insulation are improved, but light transmittance deteriorates
Solution Approach 1:
The patent applies local quality by making different parts of the holder have different transparency properties. The sidewalls are made transparent to allow light transmission, while the bottom surface maintains nontransparent insulation properties. This is achieved by using a transparent insulating material for the sidewalls and a nontransparent insulating material for the bottom surface, thus resolving the contradiction between light transmittance and electrical insulation.
Solution Approach 2:
The patent uses composite materials with different optical and electrical properties for different parts of the holder. The sidewalls use transparent insulating material that combines both transparency and electrical insulation, while the bottom uses nontransparent insulating material. This composite approach allows the holder to simultaneously achieve structural integrity, electrical insulation, and light transmittance.
2Reliability
If nontransparent material is used for the insulation area, then electrical insulation is improved, but light transmittance deteriorates
Solution Approach 1:
The patent applies local quality by differentiating the transparency of different functional areas. The insulation area in the middle section uses nontransparent insulating material to ensure electrical insulation, while the sidewalls use transparent insulating material to allow light transmission. This localized differentiation resolves the contradiction between electrical insulation reliability and light transmittance.
3Illumination intensity
If the area ratio of the first function area, insulation area, and second function area is optimized, then light transmittance is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies a particular area ratio range (1:1:1 to 5:1:1) for the first function area, insulation area, and second function area to optimize light transmittance while maintaining manufacturability. By defining this parameter range, the patent balances the need for high light transmittance with practical manufacturing precision capabilities, avoiding overly stringent requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The transparent sidewalls and insulation area allow for increased light transmittance, while the structural design enhances the stability and durability of the package device, ensuring better light coverage and user comfort.
Implementation Method 1
the material of sidewalls of the SMD holder is transparent plastic
Data Source
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AI summary
Provided is a package device, relating to the technical field of lamp beads. The package device comprises an SMD holder (1), wherein the SMD holder is a hollow housing with one end opened; and the material of sidewalls of the SMD holder is transparent plastic. In the package device provided by the present invention, a transparent material is provided as the material of the sidewalls of the SMD holder, and light generated after a chip is powered on can be partially transmitted out through the sidewalls of the SMD holder, avoiding blocking of the light generated after the chip is powered on by the sidewalls of the SMD holder, thereby increasing transmittance of light from the chip. (Fig. 1)