Transparent Substrate Camera Imager Assembly
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Solution Overview
Problem
Existing vehicle vision systems require complex assembly processes due to the need for wire bonding and additional connectors to connect imaging array circuitry to the printed circuit board, which complicates the assembly of cameras and reduces their light sensitivity.
Innovation Solution
The use of a transparent or partially transparent semiconductor substrate with photosensing elements facing the printed circuit board allows for direct electrical connection via solder balls, eliminating the need for wire bonding and enhancing assembly efficiency while maintaining light sensitivity by flipping the chip to allow light to pass through the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding and additional connectors are used to connect imaging array circuitry to the printed circuit board, then electrical connection is achieved, but assembly complexity increases and light sensitivity is reduced
Solution Approach 1:
The patent merges the electrical connection function directly into the substrate mounting process by forming conductive traces on the substrate itself, eliminating the need for separate wire bonding and connector assembly steps. This integration reduces assembly complexity while maintaining reliable electrical connections between the imaging array and the printed circuit board.
2Reliability
If metal layers are present in the substrate to provide electrical connection, then electrical conductivity is achieved, but light sensitivity is reduced due to photon-blocking
Solution Approach 1:
The patent applies local quality by forming conductive traces only in specific regions where electrical connection is needed, rather than using extensive metal layers throughout the substrate. The conductive traces are localized to interconnect regions, allowing light to pass through the majority of the substrate area to reach the photosensing elements, thereby maintaining high light sensitivity while achieving necessary electrical connectivity.
3Illumination intensity
If imaging array circuitry is disposed on the surface facing away from the printed circuit board, then light sensitivity is maintained, but additional wire bonding is required
Solution Approach 1:
The patent inverts the conventional approach by disposing the imaging array circuitry on the surface of the substrate that faces the printed circuit board, rather than facing away from it. This inversion allows direct electrical connection through conductive traces on the substrate, eliminating the need for wire bonding while maintaining light sensitivity through the substrate material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the camera assembly process, enhances light sensitivity by eliminating photon-blocking metal layers, and provides a more reliable electrical connection, improving the overall performance and efficiency of the vehicle vision system.
Implementation Method 1
The photosensing elements of the imager and imaging array circuitry are disposed on a transparent or at least partially visible light transmitting substrate
Data Source
AI summary
A camera for a vision system for a vehicle includes an imager chip having an at least partially light transmitting substrate having a photosensor array disposed at a second surface of the at least partially light transmitting substrate so as to sense light that passes through the at least partially light transmitting substrate. The imager chip includes electrically conductive pads disposed at the second surface of the at least partially light transmitting substrate. A circuit element includes circuitry disposed at least at a third surface thereof. The imager chip is mounted at the circuit element with the second surface of the at least partially light transmitting substrate opposing the third surface of the circuit element. Electrical connection between the electrically conductive pads and the circuitry of the circuit element is made when mounting the imager chip at the circuit element.