Transparent Substrate Stack for Stable Electrostatic Chucking
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Solution Overview
Problem
The chucking force of an electrostatic chuck decreases during semiconductor processes, leading to instability and disruption in the fabrication of semiconductor devices.
Innovation Solution
A semiconductor device structure is designed with a conductive layer on a transparent substrate, which enhances the chucking force by utilizing the electrostatic chuck's conductivity, eliminating the need for pre-baking and vacuum pumping, and allowing for improved process stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an electrostatic chuck is used to hold the semiconductor substrate, then the substrate can be fixed in place for fabrication processes, but the chucking force decreases during the processes leading to instability
Solution Approach 1:
The patent introduces a conductive layer with optimized electrical properties on the substrate surface, changing the electrical parameters to enhance the electrostatic interaction with the chuck, thereby maintaining stable chucking force throughout the fabrication process
Solution Approach 2:
The patent employs a composite structure combining the semiconductor substrate with a conductive layer, creating a composite material system that exhibits improved electrostatic adhesion properties compared to the substrate alone
2Reliability
If pre-baking and vacuum pumping are performed to maintain chucking force, then process stability can be improved, but manufacturing time increases
Solution Approach 1:
The conductive layer is prepared in advance during substrate fabrication, pre-establishing the enhanced electrostatic adhesion capability before the chucking process begins, eliminating the need for time-consuming pre-baking and vacuum pumping steps
Solution Approach 2:
The conductive layer inherently provides the enhanced adhesion property, making the substrate self-sufficient for maintaining chucking force without requiring additional external processing steps like pre-baking or vacuum pumping
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced chucking force stabilizes the semiconductor processes, reduces manufacturing time, and extends the life span of the electrostatic chuck, while maintaining process integrity.
Implementation Method 1
the chucking force of an electrostatic chuck decreases during semiconductor processes... A semiconductor device structure is designed with a conductive layer on a transparent substrate, which enhances the chucking force by utilizing the electrostatic chuck's conductivity
Data Source
AI summary
A semiconductor device structure is provided. The semiconductor device structure includes a first transparent substrate, a conductive layer, an insulating protective layer, a second transparent substrate, a device substrate, and a bonding layer. The first transparent substrate has a first surface and an opposite second surface. The conductive layer is disposed on the second surface of the first transparent substrate. The insulating protective layer covers the conductive layer and the first transparent substrate. The second transparent substrate is disposed above the first transparent substrate, and has a first surface facing the first transparent substrate and an opposite second surface. The device substrate is disposed on the second surface of the second transparent substrate. The bonding layer is bonded to the insulating protective layer and the first surface of the second transparent substrate.