Transparent Substrate with Epoxy Coupling Agent for Adhesion
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Solution Overview
Problem
Conventional methods for reducing the thickness of glass substrates in display and solar cell applications result in insufficient adhesiveness between the glass and resin layers, particularly under high-temperature and high-humidity conditions, leading to poor impact resistance and flexibility.
Innovation Solution
A transparent substrate is created by applying a thermoplastic resin solution with a hydroxy group terminal and an epoxy group-terminated coupling agent to the glass, forming a strong chemical bond between the glass and resin layers, enhancing adhesiveness and mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the thickness of glass substrate is reduced to achieve weight reduction and flexibility, then the substrate becomes easier to handle in terms of flexibility, but the impact resistance becomes insufficient
Solution Approach 1:
The patent applies composite materials by combining thin glass substrate with resin layers (such as polyimide or acrylic resin) to create a laminated structure. This composite construction allows the substrate to maintain flexibility from the resin layers while the glass provides structural support and impact resistance, resolving the contradiction between flexibility and impact resistance in thinned substrates
2Ease of operation
If conventional resin application methods are used to provide flexibility, then the resin layer can be formed on glass substrate, but the adhesiveness between glass and resin layer becomes insufficient under high-temperature and high-humidity conditions
Solution Approach 1:
The patent employs parameter changes by carefully controlling the glass transition temperature (Tg) of the resin within specific ranges (80°C ≤ Tg < 150°C for acrylic resin, 150°C ≤ Tg < 200°C for polyimide resin) and adjusting molecular weight parameters. These parameter optimizations ensure the resin maintains appropriate adhesive properties under high-temperature and high-humidity conditions while providing the required flexibility
Solution Approach 2:
The patent applies local quality by using different resin materials with specific properties at different locations or functions: acrylic resin with lower Tg for enhanced flexibility and adhesion, and polyimide resin with higher Tg for heat resistance. This localized material selection optimizes both adhesiveness under harsh conditions and flexibility where needed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the adhesiveness, bending property, and impact resistance of the substrate, preventing crack progression and maintaining structural integrity under challenging environmental conditions.
Implementation Method 1
the inorganic glass and the resin layer comprise an epoxy group-terminated coupling agent layer therebetween
Implementation Method 2
a resin layer, which is obtained by applying a solution of a thermoplastic resin onto one side or both sides of the inorganic glass
Data Source
Figure 1(a)~1(b)
AI summary
There is provided a transparent substrate which can be reduced in thickness, which is excellent in adhesiveness between an inorganic glass and a resin layer under a high-temperature and high-humidity environment, bending property, flexibility, and impact resistance, and which significantly prevents the progress of a crack in a glass. A transparent substrate according to an embodiment of the present invention includes: an inorganic glass; and a resin layer, which is obtained by applying a solution of a first thermoplastic resin, epoxy group-terminated coupling agent and cyclic ether compound onto one side or both sides of the inorganic glass, wherein: the solution comprises a first thermoplastic resin having a hydroxy group at a terminal, and applying a solution of a second thermoplastic resin onto the first thermoplastic resin layer.