Transparent Composite Substrate for Low-Loss High-Frequency Bonding
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Solution Overview
Problem
Conventional substrates for high frequency devices suffer from insufficient low dielectric loss tangent property, adhesion, and durability, which are critical for maintaining performance over time, especially in high frequency applications.
Innovation Solution
A substrate comprising a transparent glass substrate bonded to a transparent resin base material via an optical clear adhesive, with specific properties such as a dielectric loss tangent of 0.01 or less, peel strength of 3.0 N/cm or more, and out gas amount of 5.0 μg/g or less, using materials like cycloolefin polymer resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional insulating substrates (resin, ceramic, or glass) are used for high frequency devices, then the substrate can be manufactured with existing processes, but the dielectric loss tangent is insufficient and adhesion to mounted base materials is poor
Solution Approach 1:
The invention uses a composite structure consisting of a glass substrate bonded to a resin base material with specific properties (dielectric loss tangent ≤0.01, peel strength ≥3.0 N/cm, out gas ≤5.0 μg/g). This composite approach combines the low dielectric loss of glass with the manufacturability and adhesion benefits of specially formulated resin materials, resolving the contradiction between reliability and ease of manufacture.
Solution Approach 2:
The invention specifies precise parameter ranges for the resin base material (dielectric loss tangent ≤0.01, peel strength ≥3.0 N/cm, out gas ≤5.0 μg/g) to optimize performance. By controlling these parameters, the resin material achieves both low dielectric loss for high frequency applications and sufficient adhesion strength, while remaining manufacturable with existing processes.
2Strength
If conventional substrates are used, then manufacturing is simpler, but adhesion to copper wire base materials and durability over time are insufficient
Solution Approach 1:
The composite structure of glass substrate + resin base material bonded via optical clear adhesive provides both strong adhesion to copper wire base materials and long-term durability. The resin layer acts as an adhesive interface while the glass provides structural stability, achieving high strength without excessive structural complexity.
Solution Approach 2:
The resin base material serves as an intermediary layer between the glass substrate and the copper wire base material. This intermediate layer provides both adhesion to the metal and compatibility with the glass substrate, achieving strong bonding without requiring complex direct bonding processes.
3Reliability
If conventional resin base materials are used, then manufacturing is easier, but dielectric loss is high and out gas emission exceeds acceptable levels
Solution Approach 1:
The invention specifies precise parameter ranges for the resin base material (dielectric loss tangent ≤0.01, out gas ≤5.0 μg/g) to optimize high frequency performance. By controlling these parameters, the resin material achieves both low dielectric loss and minimal out gas emission while remaining manufacturable with existing processes.
Data Source
AI summary
To provide a substrate for a high frequency device, which satisfies requirements of low dielectric loss tangent, adhesion and transparency.A substrate for a high frequency device comprising a transparent glass substrate 16 and a transparent resin base material 20 bonded to the glass substrate 16 via an optical clear adhesive 18, wherein the dielectric loss tangent of the resin base material 20 in dielectric loss tangent measurement test is 0.01 or less, the peel strength in peel test is 3.0 Worn or more, and the amount of out gas in out gas test is 5.0 μg/g or less.