Transparent Substrate Optoelectronic Modules for Thin Wearables

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Solution Overview

Problem

The thickness of typical optoelectronic modules, comprising a substrate and a transparent cover, is unsuitable for applications in small host devices such as wearable devices and mobile devices, as it exceeds the available space.

Innovation Solution

The development of optoelectronic modules with a transparent substrate and a conductive layer on one side, featuring electrically conductive vias and a housing on the other side, which are designed to be thin and transmissive to specific wavelengths of electromagnetic radiation, along with optical elements and connectors, allowing for reduced thickness while maintaining functionality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If a substrate and transparent cover are used in the optoelectronic module, then mechanical support and light transmission are provided, but the overall thickness increases making it unsuitable for small host devices

Engineering Contradiction:
ImprovethicknessVSAvoidmechanical support
Core Design Contradiction:
Length of moving objectVSReliability

Solution Approach 1:

The patent merges the substrate and cover functions into a single transparent substrate that provides both mechanical support and light transmission. The optoelectronic component is mounted directly on the back side of this integrated transparent substrate, eliminating the need for a separate cover and reducing overall thickness while maintaining structural integrity and optical functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent repositions the optoelectronic component from the front side to the back side of the transparent substrate. This dimensional reconfiguration allows the component to be accessible from the rear while the front surface remains clear for light transmission, effectively utilizing the z-dimension to resolve the thickness conflict.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Length of moving object

If the optoelectronic component is mounted on the transparent substrate, then light detection and generation capabilities are maintained, but the module thickness increases

Engineering Contradiction:
ImprovethicknessVSAvoidelectrical connection
Core Design Contradiction:
Length of moving objectVSEase of operation

Solution Approach 1:

The patent segments the electrical connection path into two parts: conductive vias extending through the transparent substrate from the front to back surface, and conductive traces on the back surface connecting the vias to the optoelectronic component. This segmentation allows electrical connections to be made from the rear side, simplifying assembly and reducing the need for additional connection layers that would increase thickness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The transparent substrate acts as an intermediary element that simultaneously serves as a mechanical support structure, an optical transmission medium, and a carrier for integrated conductive vias. This multi-functional intermediary enables the optoelectronic component to be electrically connected while maintaining thin profile and optical transparency.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the creation of optoelectronic modules that are thin enough to be accommodated in small host devices without compromising light detection or generation capabilities, making them suitable for use in wearable and mobile devices.

Implementation Method 1

the transparent substrate being transmissive to the particular wavelength of electromagnetic radiation

Methodology Applied
Scientific EffectTransmissivity: Absorption (EM radiation)

Implementation Method 2

a plurality of electrically conductive vias disposed between the first and second sides of the transparent substrate and being in electrical communication with the optoelectronic component and the conductive layer

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentEP3732732B1Optoelectronic modules having transparent substrates and method for manufacturing the same
Publication Date: 2023.03.01 AMS OSRAM ASIA PACIFIC PTE LTD
  • EP3732732B1 patent drawingFigure 1A~1F
  • EP3732732B1 patent drawingFigure 2A~2E
  • EP3732732B1 patent drawingFigure 2F~2J

AI summary

Optoelectronic modules exhibiting relatively small thickness and methods for their manufacture are disclosed. The optoelectronic modules include substrates and transparent covers. Each optoelectronic module includes a transparent substrate on which an optoelectronic component is mounted. The optoelectronic component can be sensitive to and/or operable to generate a particular wavelength of electromagnetic radiation. The transparent substrate is transmissive to the particular wavelength of electromagnetic radiation. In some instances, the transparent substrate is composed, at least partially of glass.