Transparent Thermal Spreader for Optical Status Verification
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Solution Overview
Problem
The mechanical protection of electronic packages obscures the status of integrated circuits, making it difficult to verify their functionality and authenticity, which can lead to the proliferation of counterfeit circuits.
Innovation Solution
Incorporating transparent areas in the package lid and thermal spreader to allow light transmission, enabling optical paths for status or data signals to be communicated externally, and using light sources and sensors to indicate operational characteristics or identity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the integrated circuit is encapsulated by the electronic package for protection, then the integrated circuit is physically protected from external environments and mechanical stresses, but the status of the integrated circuit cannot be visually detected
Solution Approach 1:
The patent utilizes light transmission through transparent areas of the package lid and thermal spreader to enable visual detection of LED status indicators. The transparent regions allow light from internal LEDs to pass through to external observers, providing color-based status information without compromising the protective encapsulation of the integrated circuit.
Solution Approach 2:
The patent introduces transparent areas in the package lid and thermal spreader as intermediary elements that allow light to pass through while maintaining the protective function. These transparent regions act as mediators between the internal LED status indicators and external observers, enabling status detection without exposing the integrated circuit.
2Reliability
If the electronic package encapsulates the integrated circuit, then the integrated circuit is protected, but counterfeiters can pass counterfeit circuits by mimicking the package mechanics
Solution Approach 1:
The patent uses light transmission through transparent areas to enable visual verification of integrated circuit authenticity. Genuine circuits with functional LEDs will emit light visible through the transparent package regions, while counterfeit circuits without functional LEDs will not emit light, allowing consumers to distinguish authentic from counterfeit products.
Solution Approach 2:
The patent implements a feedback mechanism where the LED status indicators provide visual information about the functional state and authenticity of the integrated circuit. This feedback is transmitted through the transparent areas of the package, allowing external observers to verify whether the circuit is genuine and functioning properly.
3Difficulty of detecting and measuring
If transparent areas are added to the package lid and thermal spreader, then light transmission is enabled for status indication, but the structural integrity and thermal performance may be compromised
Solution Approach 1:
The patent applies local quality by creating specific transparent areas in the package lid and thermal spreader rather than making the entire structures transparent. These localized transparent regions are positioned to allow light transmission for LED status indication while the remaining portions of the package lid and thermal spreader maintain their original structural and thermal properties.
4Difficulty of detecting and measuring
If transparent areas are added to the package lid and thermal spreader, then light transmission is enabled for status indication, but the manufacturing complexity increases
Solution Approach 1:
The patent creates transparent areas in specific locations of the package lid and thermal spreader using techniques such as molding, machining, or material selection. These localized modifications are integrated into the existing manufacturing processes, adding minimal complexity while enabling the desired light transmission functionality for status indication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables external detection of light signals from integrated circuits, providing a means to verify their status and authenticity, thereby preventing counterfeiting.
Implementation Method 1
the one or more transparent lid areas are configured to allow transmission of light through the package lid or within the package
Implementation Method 2
Electronic packages may also include thermal spreaders that conduct heat generated by the integrated circuit during use
Data Source
AI summary
A system is disclosed that includes an electronic package. The electronic package includes a package base couplable to a host substrate, and a package lid mechanically coupled to the package base that includes one or more transparent lid areas, configured to permit transmission of light. The electronic package further includes a thermal spreader bonded on a first side to a first side of the package lid. The thermal spreader includes one or more transparent spreader areas that are configured to allow transmission of light through the thermal spreader. The electronic package further includes one or more integrated circuits bonded to a second side of the thermal spreader that communicatively coupled to the host substrate. The electronic package further includes one or more optical paths that include at least one of the one or more transparent spreader areas configured adjacent to at least one of the transparent lid areas.