Transparent Window in Security Substrate via Direct Filling
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Solution Overview
Problem
The existing methods for creating transparent windows in security substrates, such as security paper substrates, require a dedicated lamination step that increases production costs.
Innovation Solution
A method and device that fill an opening in the security substrate with transparent material while the substrate is open on both sides, eliminating the need for pre-lamination of a film, and using a supporting member to block one side of the opening during the filling process, with UV-curable materials and screen printing for application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a lamination step is used to close one side of the opening with a transparent film, then the opening can be properly sealed for filling, but production costs increase due to the dedicated processing step
Solution Approach 1:
The invention extracts and eliminates the lamination step from the manufacturing process by using a different approach - applying transparent material directly to the open substrate through screen printing or similar deposition techniques, thereby removing the need for separate film lamination while maintaining opening sealing functionality
Solution Approach 2:
The patent introduces a supporting member as an intermediary element that temporarily supports the substrate during material application. This supporting member enables direct material deposition onto the open substrate without requiring lamination, serving as a mediator that facilitates the alternative manufacturing approach
2Ease of manufacture
If the opening is filled while open on both sides, then lamination is eliminated and production costs reduce, but control over the filling process becomes more difficult
Solution Approach 1:
The supporting member acts as an intermediary that temporarily closes one side of the opening during material application. This allows the substrate to remain open on the other side for material deposition while providing the structural control normally achieved through lamination, thereby simplifying the overall process without sacrificing filling control
Solution Approach 2:
The supporting member is applied to the substrate before the transparent material application step. This preliminary action prepares the substrate by providing temporary support and opening closure, enabling subsequent direct material deposition without requiring prior lamination of a transparent film
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs by eliminating the lamination step and allows for the creation of transparent windows in security substrates without prior film application, enabling efficient and cost-effective production of security printing applications like banknotes.
Implementation Method 1
The transparent material is UV-curable and the application system includes a UV source arranged to cure the transparent material from the second side of the substrate
Data Source
AI summary
There is described a method of creating a transparent window (W*) in a security, especially paper, substrate (1) for security printing applications, the method comprising the steps of (i) providing a security substrate (1), (ii) forming an opening (10*) into and through the security substrate (1), and (iii) filling the opening (10*) with transparent material (2) thereby forming the transparent window (W*). The filling of the opening (10*) with the transparent material (2) is carried out in a state where the opening (10*) is open on both sides of the security substrate (1) and extends through the security substrate (1), the filling of the opening (10*) including the application of a first side (I) of the security substrate (1) against a supporting surface (21A) of a supporting member (20′, 21) in such a way as to block one side of the opening (10*), while the transparent material (2) is applied inside the opening (10*) from the other side (II) of the security substrate (1). Advantageously, the method further comprises the step of forming a field of lenses (L) on one side of the transparent window (W*), in particular by replicating the field of lenses (L) directly into the transparent material (2) filling the opening (10*). Also described is a suitable device designed to fill the opening (10*) with the transparent material (2).