Transparent Window Member Layout Using Through-Hole Separation
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Solution Overview
Problem
The existing method of cutting glass substrates to form regular octagonal or polygonal windows results in unused portions of the substrate, limiting the number of glass windows that can be obtained.
Innovation Solution
A method involving forming through holes in a transparent substrate, separating it along imaginary lines connecting the holes' centers, and optionally using laser irradiation and etching to create modified portions, with a metalized film and antireflection film for enhanced airtightness and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a glass substrate is cut into regular octagonal or polygonal glass windows using conventional cutting methods, then the shape and size of the windows can be controlled, but portions of the substrate cannot be used and the number of windows obtained is limited
Solution Approach 1:
The substrate is divided into multiple regions by forming through holes at specific positions, and then separated along imaginary lines connecting the centers of these through holes. This segmentation approach allows the entire substrate to be efficiently divided into multiple usable transparent members, minimizing waste and maximizing the number of obtainable windows.
Solution Approach 2:
Through holes are formed in advance at predetermined positions on the substrate before the actual separation process. These through holes serve as markers that define the boundaries and centers for subsequent separation, enabling precise and efficient division of the substrate into multiple usable portions without material loss.
2Ease of manufacture
If the transparent substrate is separated by dicing, then the separation process is efficient, but chipping may occur at the corners and sides
Solution Approach 1:
Different surface treatments are applied to different regions of the transparent member: etched surfaces are formed at corners and sides to prevent chipping, while the central regions maintain their original quality. This local differentiation ensures both manufacturing efficiency through dicing and structural integrity at vulnerable areas.
Solution Approach 2:
The potential harm of dicing-induced chipping is converted into a benefit by deliberately forming etched surfaces at corners and sides. These etched portions act as stress-relief features that prevent chipping while allowing the use of efficient dicing separation methods.
3Productivity
If laser irradiation and etching are used to form through holes and modified portions, then the number of transparent members can be increased, but additional process steps are required
Solution Approach 1:
The formation of through holes and modified portions is achieved by merging laser irradiation and etching processes into a single integrated workflow. The laser creates modified portions that facilitate subsequent etching, combining two functions (hole formation and surface modification) into a coordinated process sequence that maximizes substrate utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method increases the number of transparent members obtained from a substrate while ensuring airtightness and reliability as window components for optical elements, minimizing waste and reducing the likelihood of chipping during solder bonding.
Implementation Method 1
irradiating points on the transparent substrate where the through holes are to be formed with laser light to provide modified portions
Implementation Method 2
the separating of the transparent substrate in the second step is preferably performed by dicing
Data Source
AI summary
Provided is a method for manufacturing a transparent member that can increase the number of transparent members obtained from a transparent substrate as a base material. A method for manufacturing a transparent member includes: a first step of forming a plurality of through holes 3 in a transparent substrate 2; and a second step of separating the transparent substrate 2 along an imaginary line X1, Y1 connecting centers of the plurality of through holes 3, thus obtaining a transparent member.