Transparent Wiring Board Layout for Uniform Antenna Current
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Solution Overview
Problem
Conventional film antennas in mobile devices face challenges with visibility due to non-formed regions, and current distribution is not uniform, leading to suboptimal antenna characteristics.
Innovation Solution
A wiring board design featuring a substrate with first and second wirings arranged in a line-and-space shape, where the second wiring is orthogonal to the first, with specific line width and surface area configurations to enhance conductivity and transparency, and a method for manufacturing that includes forming conductive layers and trenches to achieve these configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a mesh-like conductor mesh layer with opening portions is used in a transparent antenna, then the antenna can be mounted on a display region, but the non-formed regions reduce the overall conductivity and antenna performance
Solution Approach 1:
The patent merges the antenna conductor layer with the transparent wiring board structure, integrating the antenna pattern into the wiring board itself rather than using a separate mesh layer with openings. This eliminates the non-formed regions while maintaining transparency and conductivity throughout the entire antenna area.
Solution Approach 2:
The patent uses a transparent resin material with controlled transparency to create a uniform conductor distribution. The transparent nature of the material allows radio waves to pass through while maintaining continuous conductivity, avoiding the discontinuous structure of mesh patterns with opening portions.
2Reliability
If a mesh-like conductor pattern is used, then the antenna can provide radio wave transmission and reception, but the current distribution becomes non-uniform with higher current at edges and lower current at center
Solution Approach 1:
The patent applies different conductor widths at different locations to achieve uniform current distribution. The conductor width is increased at the center region where current tends to be lower, and reduced at edge regions where current is naturally higher, creating a compensated distribution that improves antenna performance.
Solution Approach 2:
The patent changes the conductor width parameter across different regions of the antenna pattern. By varying the width of the transparent conductor traces, the impedance and current distribution are optimized to achieve more uniform current flow throughout the antenna structure.
3Reliability
If the conductor layer is made thicker to improve conductivity, then the antenna performance improves, but the transparency of the display region is reduced
Solution Approach 1:
The patent uses a transparent conductive material that combines the properties of electrical conductivity and optical transparency. This composite material allows the conductor to maintain adequate thickness for good conductivity while remaining transparent to visible light, solving the trade-off between conductivity and transparency.
Solution Approach 2:
The patent optimizes the thickness parameter of the conductor layer to achieve a balance between conductivity and transparency. By carefully controlling the thickness within a specific range, the antenna maintains sufficient electrical performance while preserving the transparency needed for display applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves the visibility and reliability of the antenna pattern by making current distribution more uniform, enhancing antenna characteristics and maintaining transparency, allowing for better radio wave transmission and reception.
Implementation Method 1
forming a thin-film layer of copper or an alloy thereof on the substrate by physical thin film forming means
Implementation Method 2
forming a copper thick-film layer on the thin-film layer by plating means
Data Source
Figure 1
Figure 2(A)~2(B)
Figure 3(A)~3(B)
AI summary
A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and a second wiring which is arranged on the upper surface of the substrate, extends in a second direction intersecting with the first direction, and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring, and each of the pair of side surfaces of the second wiring is recessed inward.