Transparent Wiring Board Layout for Feeding Unit Durability

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Solution Overview

Problem

The high electric current density near the feeding unit in film antennas leads to increased line breakage and separation between the protective layer and the feeding unit, limiting the durability and design flexibility of portable terminal devices.

Innovation Solution

A wiring board design with larger line widths for first-direction wiring lines near the feeding unit, connected by second-direction wiring lines, and a protective layer covering the feeding unit, along with through or non-through holes in the feeding unit to enhance durability and reduce separation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Duration of action of stationary object

If the conductor mesh layer is used for a long period of time, then the antenna functionality is maintained, but line breakage occurs more often in the region near the feeding unit due to high electric current density

Engineering Contradiction:
Improveservice life of antennaVSAvoidline breakage resistance
Core Design Contradiction:
Duration of action of stationary objectVSReliability

Solution Approach 1:

The patent applies local quality by making the line width of the conductor mesh layer non-uniform, specifically wider in the first region near the feeding unit and narrower in the second region farther away. This local variation in geometric property addresses the non-uniform electric current density distribution, providing enhanced line breakage resistance where the current density is highest while maintaining overall antenna functionality.

Inventive Principle:
Principle #3Local quality

2Strength

If a protective layer is formed uniformly over the entire feeding unit, then the feeding unit is covered for protection, but separation occurs between the protective layer and the feeding unit

Engineering Contradiction:
Improveprotective coverageVSAvoidadhesion between protective layer and feeding unit
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent applies local quality by forming the protective layer only in a specific region of the feeding unit that corresponds to the first region of the conductor mesh layer, rather than uniformly over the entire feeding unit. This localized protective coverage prevents separation issues while still providing protection where the conductor mesh layer is most vulnerable to line breakage.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12593395B2Wiring board and method for manufacturing wiring board
Publication Date: 2026.03.31 DAI NIPPON PRINTING CO LTD
  • US12593395B2 patent drawing
  • US12593395B2 patent drawing
  • US12593395B2 patent drawing

AI summary

A wiring board (10) includes a substrate (11) that is transparent, a wiring pattern region (20) disposed on the substrate (11) and having first-direction wiring lines (21), and a feeding unit (40) electrically connected to the first-direction wiring lines (21) of the wiring pattern region (20). Each first-direction wiring line (21) has a first region (26) positioned near the feeding unit (40) and a second region (27) that is a region other than the first region (26). A line width (W3) of the first-direction wiring line (21) in the first region (26) is larger than a line width (W1) of the first-direction wiring line (21) in the second region (27).