Transparent Zinc Oxide Thin Film Transistor for Low Power Flat Panel Displays

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Solution Overview

Problem

Conventional thin film transistors (TFTs) with opaque semiconductor layers limit channel width, restricting current flow and increasing power consumption in flat panel display devices due to high voltage requirements.

Innovation Solution

A TFT with a transparent semiconductor layer made of zinc oxide, exhibiting a charge concentration of 1×10^14 to 1×10^17 atom/cm^3, formed using atomic layer deposition with nitrogen-based oxidizing agents, which reduces charge concentration and enhances off-current characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If opaque semiconductor layers are used in conventional TFTs, then the device structure is simple and manufacturing is easier, but the channel width is limited and power consumption increases

Engineering Contradiction:
Improveease of manufactureVSAvoidpower consumption
Core Design Contradiction:
Ease of manufactureVSUse of energy by moving object

Solution Approach 1:

The patent changes the optical parameter of the semiconductor layer from opaque to transparent, enabling wider channel formation. This parameter change allows light to pass through the semiconductor layer, facilitating broader channel width without increasing opacity, thereby reducing resistance and power consumption while maintaining manufacturing feasibility through established transparent material deposition techniques

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structures combining transparent semiconductor layers with conductive materials for source/drain electrodes and gate electrodes. This composite approach allows the semiconductor layer to remain transparent while integrating functional conductive elements, achieving both optical transparency for wide channels and electrical functionality for low power consumption

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If opaque semiconductor layers are used in conventional TFTs, then the manufacturing process is conventional and simpler, but the channel width cannot be increased due to opaque characteristics

Engineering Contradiction:
Improveease of manufactureVSAvoidchannel width
Core Design Contradiction:
Ease of manufactureVSLength of moving object

Solution Approach 1:

The patent changes the optical parameter of the semiconductor layer from opaque to transparent, enabling wider channel formation. This parameter change allows light to pass through the semiconductor layer, facilitating broader channel width without increasing opacity, thereby reducing resistance and power consumption while maintaining manufacturing feasibility through established transparent material deposition techniques

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent transitions from considering only the horizontal dimensions of the channel to incorporating the optical dimension (transparency). By making the semiconductor layer transparent, the design gains an additional dimensional property that allows light interaction, enabling wider channel width that would be constrained in opaque materials, thus expanding the design space for channel geometry

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If high voltage is applied to overcome limited channel width in conventional TFTs, then the channel can function, but power consumption increases and OLED deterioration occurs

Engineering Contradiction:
Improvedevice functionalityVSAvoidpower consumption and OLED deterioration
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent changes the optical parameter of the semiconductor layer from opaque to transparent, enabling wider channel formation. This parameter change allows light to pass through the semiconductor layer, facilitating broader channel width without increasing opacity, thereby reducing resistance and power consumption while maintaining manufacturing feasibility through established transparent material deposition techniques

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent converts the potential harm of high voltage operation (power consumption and OLED deterioration) into benefit by using transparent semiconductor materials that enable wider channels. The wider channel naturally reduces resistance, allowing operation at lower voltages, thus converting the design challenge of limited channel width into an opportunity for improved power efficiency and device longevity

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The transparent semiconductor layer improves current flow and reduces power consumption in flat panel displays by maintaining low charge concentration, thereby enhancing the overall performance and efficiency of the TFT.

Implementation Method 1

formed using atomic layer deposition with nitrogen-based oxidizing agents

Methodology Applied
Scientific EffectAtomic layer deposition:

Implementation Method 2

formed using atomic layer deposition with nitrogen-based oxidizing agents

Methodology Applied
Scientific EffectOxidation: Oxidation

Data Source

PatentUS8003450B2Thin film transistor, method of fabricating a thin film transistor and flat panel display device having the same
Publication Date: 2011.08.23 SAMSUNG DISPLAY CO LTD
  • US8003450B2 patent drawing
  • US8003450B2 patent drawing
  • US8003450B2 patent drawing

AI summary

A thin film transistor (TFT) includes a substrate, a transparent semiconductor layer on the substrate, the transparent semiconductor layer including zinc oxide and exhibiting a charge concentration of about 1×1014 atom/cm3 to about 1×1017 atom/cm3, a gate electrode on the substrate, a gate insulating layer between the gate electrode and the transparent semiconductor layer, the gate insulting layer insulating the gate electrode from the transparent semiconductor layer, and source and drain electrodes on the substrate, the source and drain electrodes being in contact with the transparent semiconductor layer.